Patents by Inventor Ivan Ward

Ivan Ward has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sputter target and backing plate assembly
    Patent number: 7891537
    Abstract: A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: February 22, 2011
    Assignee: Praxair S. T. Technology, Inc.
    Inventors: Joseph C. Facey, Ivan Ward
  • SPUTTER TARGET AND BACKING PLATE ASSEMBLY
    Publication number: 20100187098
    Abstract: A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced.
    Type: Application
    Filed: April 6, 2010
    Publication date: July 29, 2010
    Inventors: Joseph C. Facey, Ivan Ward
  • Sputter target and backing plate assembly
    Patent number: 7721939
    Abstract: A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced.
    Type: Grant
    Filed: July 16, 2008
    Date of Patent: May 25, 2010
    Assignee: Praxair S. T. Technology, Inc.
    Inventors: Joseph C. Facey, Ivan Ward
  • SPUTTER TARGET AND BACKING PLATE ASSEMBLY
    Publication number: 20080271997
    Abstract: A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced.
    Type: Application
    Filed: July 16, 2008
    Publication date: November 6, 2008
    Inventors: Joseph C. Facey, Ivan Ward
  • Method for centering a sputter target onto a backing plate and the assembly thereof
    Patent number: 7431195
    Abstract: A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: October 7, 2008
    Assignee: Praxair S.T. Technology, Inc.
    Inventors: Joseph C. Facey, Ivan Ward
  • High purity ferromagnetic sputter target, assembly and method of manufacturing same
    Patent number: 6988306
    Abstract: Provided is a method of forming ferromagnetic sputter targets and sputter target assemblies having a uniform distribution of magnetic leakage flux. The method includes providing a ferromagnetic sputter workpiece and hot rolling the workpiece to a substantially circular configuration sputter target; machining a taper in a surface of the sputter target to have a thickness gradient of the sputter target, where the center of the sputter target is about 0.020 to about 0.005 inches thinner than the edge of the sputter target, and where the magnetic leakage flux across the sputter target is uniformly distributed.
    Type: Grant
    Filed: December 1, 2003
    Date of Patent: January 24, 2006
    Assignee: Praxair Technology, Inc.
    Inventors: Holger J. Koenigsmann, Paul S. Gilman, Ivan Ward
  • High purity ferromagnetic sputter target, assembly and method of manufacturing same
    Publication number: 20050115045
    Abstract: Provided is a method of forming ferromagnetic sputter targets and sputter target assemblies having a uniform distribution of magnetic leakage flux. The method includes providing a ferromagnetic sputter workpiece and hot rolling the workpiece to a substantially circular configuration sputter target; machining a taper in a surface of the sputter target to have a thickness gradient of the sputter target, where the center of the sputter target is about 0.020 to about 0.005 inches thinner than the edge of the sputter target, and where the magnetic leakage flux across the sputter target is uniformly distributed.
    Type: Application
    Filed: December 1, 2003
    Publication date: June 2, 2005
    Inventors: Holger Koenigsmann, Paul Gilman, Ivan Ward
  • Method for centering a sputter target onto a backing plate and the assembly thereof
    Publication number: 20050067469
    Abstract: A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced.
    Type: Application
    Filed: September 26, 2003
    Publication date: March 31, 2005
    Inventors: Joseph Facey, Ivan Ward