Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. In some embodiments, a ventilation trench and an isolation trench are concurrently within a capping substrate. The isolation trench isolates a silicon region and has a height substantially equal to a height of the ventilation trench. A sealing structure is formed within the ventilation trench and the isolation trench, the sealing structure filing the isolation trench and defining a vent within the ventilation trench. A device substrate is provided and bonded to the capping substrate at a first gas pressure and hermetically sealing a first cavity associated with a first MEMS device and a second cavity associated with a second MEMS device. The capping substrate is thinned to open the vent to adjust a gas pressure of the second cavity.

Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.

Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.

Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.

Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. In some embodiments, a ventilation trench and an isolation trench are concurrently within a capping substrate. The isolation trench isolates a silicon region and has a height substantially equal to a height of the ventilation trench. A sealing structure is formed within the ventilation trench and the isolation trench, the sealing structure filing the isolation trench and defining a vent within the ventilation trench. A device substrate is provided and bonded to the capping substrate at a first gas pressure and hermetically sealing a first cavity associated with a first MEMS device and a second cavity associated with a second MEMS device. The capping substrate is thinned to open the vent to adjust a gas pressure of the second cavity.

Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.

Abstract: A pixel structure for a liquid crystal display has a first substrate with respect to a pixel region. A W-like extruding structure composed of two V-like is formed on a surface of the substrate. A second substrate with several openings is also provided in parallel to the first substrate. The openings of the second substrate are aligned along a direction from a tip of the V-like to an edge of the pixel. Moreover, a liquid crystal layer is located between the first substrate and a second substrate, wherein the extruding structure abuts the liquid crystal layer.

Abstract: The present invention discloses a method and structure for accelerating image-sensing speed in a CCD image-sensing device. According to the present invention, specific shift-control electrodes (G2j−1 and G2j) are biased to serve as a block unit. After the CCD image-sensing device serially shifts out the charge packets actually corresponding to the image of a sensed object, the CCD image-sensing device can repeat the operation for image sensing without first shifting out the remaining or undesired charge packets, thereby accelerating image-sensing speed.

Abstract: The invention provides a method for forming a multi-gap liquid crystal display. The method includes providing a substrate. A first insulating layer is formed on the substrate. Several bus lines are formed on the first insulating layer. A second insulating layer is formed on the first insulating layer and the bus lines. The bus lines divides the substrate into a first color region, a second color region, and a third color region. A photoresist layer covers the second color region and the third color region, where the photoresist layer at the second color region is thinner than that at the third color region. A portion of the first insulating layer and the second insulating layer is etched to expose the substrate at the first color region. A portion of the photoresist layer at the second color region is removed, whereby the second insulating layer is exposed and the remaining photoresist layer still covers the third color region and the bus lines.

Abstract: The invention provides a method for forming a multi-gap liquid crystal display. The method includes providing a substrate. A first insulating layer is formed on the substrate. Several bus lines are formed on the first insulating layer. A second insulating layer is formed on the first insulating layer and the bus lines. The bus lines divides the substrate into a first color region, a second color region, and a third color region. A photoresist layer covers the second color region and the third color region, where the photoresist layer at the second color region is thinner than that at the third color region. A portion of the first insulating layer and the second insulating layer is etched to expose the substrate at the first color region. A portion of the photoresist layer at the second color region is removed, whereby the second insulating layer is exposed and the remaining photoresist layer still covers the third color region and the bus lines.

Abstract: A pixel structure for a liquid crystal display has a first substrate with respect to a pixel region. A W-like extruding structure composed of two V-like is formed on a surface of the substrate. A second substrate with several openings is also provided in parallel to the first substrate. The openings of the second substrate are aligned along a direction from a tip of the V-like to an edge of the pixel. Moreover, a liquid crystal layer is located between the first substrate and a second substrate, wherein the extruding structure abuts the liquid crystal layer.