Abstract: The invention relates to a method of manufacturing conductive inter-layer connections in a microsystem built by a patterned stack of flexible foils (10). Conductive inter-layer connections (210, 300, 400) made of solder material, sputtered or evaporated material or by means of carbonization of plastic material building the isolating layer (30) of the flexible foils (10) are formed to connect patterned conductive layers (40, 50) separated by means of at least one isolating layer (30) in a conductive way in order to interconnect different parts of the microsystem in an easy way.

Abstract: The invention relates to a method of packaging an electronic microsystem (200) and further to such a packaged device. With the method a packaged electronic microsystem (200) can be manufactured using a flexible foil (80) having conductive tracks (100) on at least on side of the flexible foil. The electronic microsystem (200) and the flexible foil (80) are arranged in a way that a sealed or even hermetic package can be realized and contact pads (210) of the electronic microsystem (200) are connected to conductive tracks (100) extending to the outer surface of the packaged device after folding the flexible foil (80) in the proposed way. No vias or throughholes in the flexible foil (80) are needed.