Patents by Inventor Ivelin A. Anguelov

Ivelin A. Anguelov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bathless wafer measurement apparatus and method
    Patent number: 6572456
    Abstract: A wafer measurement apparatus (10, 110) and method for measuring a film thickness property of a wafer (30) that does not require a water bath or complicated wafer handling apparatus. The apparatus includes a chuck (16) having an upper surface (20) for supporting the wafer, and a perimeter (18). Also included is a metrology module (50) for measuring one or more film thickness properties. The metrology module is arranged adjacent the chuck upper surface and has a measurement window (60) with a lower surface (64) arranged substantially parallel to the chuck upper surface, thereby defining an open volume (68). The apparatus includes a water supply system in fluid communication with the open volume via nozzles (70) for flowing water through and back-filling the volume in a manner that does not produce bubbles within the volume. A catchment (40) surrounding the chuck may be used to catch water flowing out of the volume. Methods of performing measurements of one or more wafer film properties are also described.
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: June 3, 2003
    Assignee: Sensys Instruments Corporation
    Inventors: Michael Weber-Grabau, Ivelin A. Anguelov, Edric H. Tong, Adam E. Norton, Fred E. Stanke, Badru D. Hyatt
  • Bathless wafer measurement apparatus and method
    Publication number: 20020065028
    Abstract: A wafer measurement apparatus (10, 110) and method for measuring a film thickness property of a wafer (30) that does not require a water bath or complicated wafer handling apparatus. The apparatus includes a chuck (16) having an upper surface (20) for supporting the wafer, and a perimeter (18). Also included is a metrology module (50) for measuring one or more film thickness properties. The metrology module is arranged adjacent the chuck upper surface and has a measurement window (60) with a lower surface (64) arranged substantially parallel to the chuck upper surface, thereby defining an open volume (68). The apparatus includes a water supply system in fluid communication with the open volume via nozzles (70) for flowing water through and back-filling the volume in a manner that does not produce bubbles within the volume. A catchment (40) surrounding the chuck may be used to catch water flowing out of the volume. Methods of performing measurements of one or more wafer film properties are also described.
    Type: Application
    Filed: August 10, 2001
    Publication date: May 30, 2002
    Inventors: Michael Weber-Grabau, Ivelin A. Anguelov, Edric H. Tong, Adam E. Norton, Fred E. Stanke, Badru D. Hyatt