Patents by Inventor Ivo Bolsens

Ivo Bolsens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10002100
    Abstract: An example integrated circuit (IC) system includes a package substrate having a programmable integrated circuit (IC) and a companion IC mounted thereon, the programmable IC including a programmable fabric and the companion IC including application circuitry. The IC system further includes a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC, a second SiP IO circuit disposed in the companion IC, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit. The IC System further includes first aggregation and first dispersal circuits in the programmable IC coupled between the programmable fabric and the first SiP IO circuit. The IC system further includes second aggregation and second dispersal circuits in the companion IC coupled between the application circuitry and the second SiP IO circuit.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: June 19, 2018
    Assignee: XILINX, INC.
    Inventors: Alireza S. Kaviani, Pongstorn Maidee, Ivo Bolsens
  • Publication number: 20170220509
    Abstract: An example integrated circuit (IC) system includes a package substrate having a programmable integrated circuit (IC) and a companion IC mounted thereon, the programmable IC including a programmable fabric and the companion IC including application circuitry. The IC system further includes a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC, a second SiP IO circuit disposed in the companion IC, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit. The IC System further includes first aggregation and first dispersal circuits in the programmable IC coupled between the programmable fabric and the first SiP IO circuit. The IC system further includes second aggregation and second dispersal circuits in the companion IC coupled between the application circuitry and the second SiP IO circuit.
    Type: Application
    Filed: February 2, 2016
    Publication date: August 3, 2017
    Applicant: Xilinx, Inc.
    Inventors: Alireza S. Kaviani, Pongstorn Maidee, Ivo Bolsens
  • Patent number: 6898233
    Abstract: The programmable modem for digital data of the present invention provides a highly programmable, digital modem implemented in an integrated circuit which can be customized to specific applications. The programmable modem uses spread spectrum techniques and is specifically programmable to alter the parameters of the modem to improve performance. The present invention also provides a systematic method and development kit to provide rapid customization of a modem for a particular application or for rapid specification of a high-performance application specific integrated circuit mode.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: May 24, 2005
    Assignees: IMEC vzw, SAIT Systems
    Inventors: Lieven Philips, Jan Vanhoof, Maryse Wouters, Rik De Wulf, Veerle Derudder, Carl Van Himbeeck, Ivo Bolsens, Hugo De Man, Bert Gyselinckx
  • Patent number: 6597727
    Abstract: The programmable modem for digital data of the present invention provides a highly programmable, digital modem implemented in an integrated circuit which can be customized to specific applications. The programmable modem uses spread spectrum techniques and is specifically programmable to alter the parameters of the modem to improve performance. The present invention also provides a systematic method and development kit to provide rapid customization of a modem for a particular application or for rapid specification of a high-performance application specific integrated circuit mode.
    Type: Grant
    Filed: October 5, 2001
    Date of Patent: July 22, 2003
    Assignees: IMEC vzw, SAIT Systems
    Inventors: Lieven Philips, Jan Vanhoof, Maryse Wouters, Rik De Wulf, Veerle Derudder, Carl Van Himbeeck, Ivo Bolsens, Hugo De Man, Bert Gyselinckx
  • Publication number: 20030118081
    Abstract: The programmable modem for digital data of the present invention provides a highly programmable, digital modem implemented in an integrated circuit which can be customized to specific applications. The programmable modem uses spread spectrum techniques and is specifically programmable to alter the parameters of the modem to improve performance. The present invention also provides a systematic method and development kit to provide rapid customization of a modem for a particular application or for rapid specification of a high-performance application specific integrated circuit mode.
    Type: Application
    Filed: September 27, 2002
    Publication date: June 26, 2003
    Inventors: Lieven Philips, Jan Vanhoof, Maryse Wouters, Rik De Wulf, Veerle Derudder, Carl Van Himbeeck, Ivo Bolsens, Hugo De Man, Bert Gyselinckx
  • Publication number: 20020067757
    Abstract: The programmable modem for digital data of the present invention provides a highly programmable, digital modem implemented in an integrated circuit which can be customized to specific applications. The programmable modem uses spread spectrum techniques and is specifically programmable to alter the parameters of the modem to improve performance. The present invention also provides a systematic method and development kit to provide rapid customization of a modem for a particular application or for rapid specification of a high-performance application specific integrated circuit mode.
    Type: Application
    Filed: October 5, 2001
    Publication date: June 6, 2002
    Inventors: Lieven Philips, Jan Vanhoof, Maryse Wouters, Rik De Wulf, Veerle Derudder, Carl Van Himbeeck, Ivo Bolsens, Hugo De Man, Bert Gyselinckx
  • Patent number: 6307877
    Abstract: The programmable modem for digital data of the present invention provides a highly programmable, digital modem implemented in an integrated circuit which can be customized to specific applications. The programmable modem uses spread spectrum techniques and is specifically programmable to alter the parameters of the modem to improve performance. The present invention also provides a systematic method and development kit to provide rapid customization of a modem for a particular application or for rapid specification of a high-performance application specific integrated circuit mode.
    Type: Grant
    Filed: August 21, 1998
    Date of Patent: October 23, 2001
    Assignee: IMEC
    Inventors: Lieven Philips, Jan Vanhoof, Maryse Wouters, Rik De Wulf, Veerle Derudder, Carl Van Himbeeck, Ivo Bolsens, Hugo De Man, Bert Gyselinckx
  • Patent number: 6058211
    Abstract: The present invention relates to a method and apparatus for compressing digital data, such as the digital representation of a colored image. A scanning routine is described which aims to maintain the integrity of regions of the image that the human visual system also finds important. Pixel data from the image data includes color components, e.g., intensities of three or more colors such as red, green and blue or cyan, magenta and yellow. When the color components of the pixels are represented in color space, the axes of which are the three color components with the intensities thereof as variables, it has been found experimentally, particularly for artificial or synthetic images, that significant regions in the image tend to produce clusters of points in color space. In accordance with the invention, the color space is scanned by a space filling curve to convert the coordinates in color space into a one dimensional matrix such as a histogram. If certain types of space filling curves are used, e.g.
    Type: Grant
    Filed: July 5, 1996
    Date of Patent: May 2, 2000
    Assignee: IMEC vzw
    Inventors: Jan Bormans, Gauthier Lafruit, Hugo De Man, Ivo Bolsens, Jan Cornelis
  • Patent number: 5872810
    Abstract: The programmable modem for digital data of the present invention provides a highly programmable, digital modem implemented in an integrated circuit which can be customized to specific applications. The programmable modem uses spread spectrum techniques and is specifically programmable to alter the parameters of the modem to improve performance. The present invention also provides a systematic method and development kit to provide rapid customization of a modem for a particular application or for rapid specification of a high-performance application specific integrated circuit mode.
    Type: Grant
    Filed: January 26, 1996
    Date of Patent: February 16, 1999
    Assignees: IMEC Co., Sait Systems
    Inventors: Lieven Philips, Jan Vanhoof, Maryse Wouters, Rik De Wulf, Veerle Derudder, Carl Van Himbeeck, Ivo Bolsens, Hugo De Man, Bert Gyselinckx
  • Patent number: 5870588
    Abstract: A hardware and software co-design environment and design methodology based on a data-model that allows one to specify, simulate, and synthesize heterogeneous hardware and software architectures from a heterogeneous specification. The environment and methodology of the invention allow for the interactive synthesis of hardware and software interfaces. The environment defines primitive objects to represent a specification of an essentially digital system. The primitive objects are defined by describing the specification of the system in one or more processes, each process representing a functional aspect of the system. Further, each of the processes have ports which are connected to ports of other processes with a channel. The ports structure communication between the processes.
    Type: Grant
    Filed: October 23, 1996
    Date of Patent: February 9, 1999
    Assignee: Interuniversitair Micro-Elektronica Centrum(IMEC vzw)
    Inventors: Karl Van Rompaey, Diederik Verkest, Jan Vanhoof, Bill Lin, Ivo Bolsens, Hugo De Man
  • Patent number: RE49163
    Abstract: An example integrated circuit (IC) system includes a package substrate having a programmable integrated circuit (IC) and a companion IC mounted thereon, the programmable IC including a programmable fabric and the companion IC including application circuitry. The IC system further includes a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC, a second SiP IO circuit disposed in the companion IC, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit. The IC System further includes first aggregation and first dispersal circuits in the programmable IC coupled between the programmable fabric and the first SiP IO circuit. The IC system further includes second aggregation and second dispersal circuits in the companion IC coupled between the application circuitry and the second SiP IO circuit.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: August 9, 2022
    Assignee: XILINX, INC.
    Inventors: Alireza S. Kaviani, Pongstorn Maidee, Ivo Bolsens