Patents by Inventor IVO RAAJMAKERS

IVO RAAJMAKERS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTERCONNECT STRUCTURE FOR USE IN AN INTEGRATED CIRCUIT
    Publication number: 20020033533
    Abstract: A structure is formed in an integrated circuit to provide for the coupling of elements in the integrated circuit. The structure extends from a conductive surface through a channel extending above the conductive surface. The structure includes a layer of a refractory metal, a layer of a metal nitride, and a layer of a metal. The layer of the refractory metal is deposited on the conductive surface and inner walls of the channel. The layer of the metal nitride is formed on the layer of the refractory metal. The layer of the metal nitride has a thickness extending from the layer of the refractory metal of less than 130 Å. The layer of the metal is deposited on the layer of the metal nitride.
    Type: Application
    Filed: March 28, 1997
    Publication date: March 21, 2002
    Inventors: MARVIN LIAO, CHYI CHERN, JENNIFER TSENG, MICHAEL DANEK, RODERICK C MOSELY, KARL LITTAU, IVO RAAJMAKERS