Patents by Inventor Ivy Chiu

Ivy Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IC design flow enhancement with CMP simulation
    Patent number: 8336002
    Abstract: An integrated circuit (IC) design method includes providing IC design layout data; simulating a chemical mechanical polishing (CMP) process to a material layer based on the IC design layout, to generate various geometrical parameters; extracting resistance and capacitance based on the various geometrical parameters from the simulating of the CMP process; and performing circuit timing analysis based on the extracted resistance and capacitance.
    Type: Grant
    Filed: March 20, 2007
    Date of Patent: December 18, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Gwan Sin Chang, Yi-Kan Cheng, Ivy Chiu, Ke-Ying Su
  • IC Design Flow Enhancement With CMP Simulation
    Publication number: 20070266356
    Abstract: An integrated circuit (IC) design method includes providing IC design layout data; simulating a chemical mechanical polishing (CMP) process to a material layer based on the IC design layout, to generate various geometrical parameters; extracting resistance and capacitance based on the various geometrical parameters from the simulating of the CMP process; and performing circuit timing analysis based on the extracted resistance and capacitance.
    Type: Application
    Filed: March 20, 2007
    Publication date: November 15, 2007
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Gwan Sin Chang, Yi-Kan Cheng, Ivy Chiu, Ke-Ying Su