Abstract: A printed circuit board, an in-circuit test structure and a method for producing the in-circuit test structure thereof are disclosed. The in-circuit test structure comprises a via and a test pad. The via passes through the printed circuit board for communicating with an electrical device to be tested on the printed circuit board. The test pad is formed on an upper surface of the printed circuit board and covering the via, wherein a center of the via deviates from a center of the test pad. In the in-circuit test, the accuracy of the test data can be improved by means of the in-circuit test structure provided by the present invention, and thus the reliability of the test result is ensured. Also, the test efficiency of the in-circuit test is improved.

Abstract: A printed circuit board, an in-circuit test structure and a method for producing the in-circuit test structure thereof are disclosed. The in-circuit test structure comprises a via and a test pad. The via passes through the printed circuit board for communicating with an electrical device to be tested on the printed circuit board. The test pad is formed on an upper surface of the printed circuit board and covering the via, wherein a center of the via deviates from a center of the test pad. In the in-circuit test, the accuracy of the test data can be improved by means of the in-circuit test structure provided by the present invention, and thus the reliability of the test result is ensured. Also, the test efficiency of the in-circuit test is improved.

Abstract: In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to fold the wire on top of the ball bond. The wire is then bonded on top of the ball bond bump without severing the wire. This is then followed by a further set of coordinated xy motions to from the loop and bring the capillary over the second bond site (e.g., on the lead frame). The wire is then stitch bonded to the second bond site and the tail severed to complete the wire loop interconnect.

Abstract: The present invention includes a multi-frequency ultrasonic generator coupled to a multi-resonance frequency transducer capable of operating at a plurality of usable resonance frequencies. A controller is coupled to a power amplifier that drives the ultrasonic transducer and is capable of applying power, voltage or current profiles for each of the resonance frequencies to be used during a bonding operation independent of the others.