Patents by Inventor Ivy W. Qin

Ivy W. Qin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LOW LOOP HEIGHT BALL BONDING METHOD AND APPARATUS
    Publication number: 20080111252
    Abstract: In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to fold the wire on top of the ball bond. The wire is then bonded on top of the ball bond bump without severing the wire. This is then followed by a further set of coordinated xy motions to from the loop and bring the capillary over the second bond site (e.g., on the lead frame). The wire is then stitch bonded to the second bond site and the tail severed to complete the wire loop interconnect.
    Type: Application
    Filed: November 20, 2007
    Publication date: May 15, 2008
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Ivy W. Qin, Robert Wise