Abstract: A workpiece placement platform device including: an X-axis direction positioning member provided on one side of a placement platform on which to place a plate-shaped workpiece and configured to position one side edge of the workpiece in an X-axis direction by contacting the one side edge; a Y-axis direction positioning member provided on another side of the placement platform and configured to position another side edge of the workpiece in a Y-axis direction by contacting the another side edge; and a workpiece positioning member that is movable in and out relative to a workpiece placement surface of the placement platform and configured to partition the workpiece placement surface into sections in the X-axis direction and enable simultaneous positioning at the sections on the workpiece placement surface.

Abstract: A workpiece placement platform device including: an X-axis direction positioning member provided on one side of a placement platform on which to place a plate-shaped workpiece and configured to position one side edge of the workpiece in an X-axis direction by contacting the one side edge; a Y-axis direction positioning member provided on another side of the placement platform and configured to position another side edge of the workpiece in a Y-axis direction by contacting the another side edge; and a workpiece positioning member that is movable in and out relative to a workpiece placement surface of the placement platform and configured to partition the workpiece placement surface into sections in the X-axis direction and enable simultaneous positioning at the sections on the workpiece placement surface.

Abstract: The present invention provides a process for forming a semiconductor film, comprising the steps of applying a semiconductor particle dispersion liquid to a substrate surface by spray coating in such a manner that the atomized droplets of the dispersion liquid discharged from the spray coater have a mean diameter of about 30 ?m or less, and drying the coating to form a porous semiconductor film; and use of the semiconductor film obtained by the process.

Abstract: The present invention provides a process for forming a semiconductor film, comprising the steps of applying a semiconductor particle dispersion liquid to a substrate surface by spray coating in such a manner that the atomized droplets of the dispersion liquid discharged from the spray coater have a mean diameter of about 30 ?m or less, and drying the coating to form a porous semiconductor film; and use of the semiconductor film obtained by the process.

Abstract: A photovoltaic cell having a transparent first substrate (61) having semiconductor electrodes (7) supporting a photosensitizing dye, a second substrate (62) having counter electrodes (4) disposed so as to face the semiconductor electrodes (7), and an electrolyte layer disposed between the semiconductor electrode (7) and the counter electrode (4); the electrolyte layer (1) being sealed by a sealing member (2) lying between the first substrate (61) and the second substrate (62); the first substrate (61), the second substrate (62) and the sealing member (2) being formed of similar materials, and the portions of the first substrate and the second substrate that are in contact with the sealing member (2) being ultrasonically welded to the sealing member. This photovoltaic cell can maintain excellent cell performance for a long time.