Abstract: The present invention aims to provide a viscous fluid application device which allows improving manufacturing efficiency of semiconductor packages without deteriorating application position accuracy and decreasing designing flexibility. The device includes: an application unit (101) which applies viscous fluid to a substrate 140a; an application head (100) having a supply unit (102) which supplies the viscous fluid to the application unit (101); an X axis unit (110); a Y axis unit (120); a Z axis unit (130); a substrate carrying unit (140); a head height detection sensor (150); and a control unit (160). The supply unit (102) moves in the Y direction in cooperation with a movement in the Y direction of the application unit (101), and remains unmoved irrespective of a movement in the X and Z direction of the application unit (101).

Abstract: A method for treating extremely small particles of recycled polyethylene terephthalate comprises providing a quantity of RPET particles having an average mean particle size ranging from about 0.0005 inch to about 0.05 inch in diameter, heating the RPET particles to a temperature sufficient to cause at least a portion of the RPET particles to adhere to one another, and forming the adhered RPET particles into pellets, said pellets having substantially the same average surface-to-volume ratio as the bulk, un-adhered RPET particles.

Abstract: A laser beams inspection apparatus suitable for inspecting electronic components such as ICs mounted on a substrate. The inspection apparatus includes a scan mechanism. The scan mechanism works to move a laser beam emitted from a laser emitter to scan a target one of electronic components in a given scan range. The scan mechanism is designed to change orientation of emission of the laser beam to change the scan range as a function of the type (e.g., the size) of the target electronic component, thereby minimizing inspection errors regardless of the type of the electronic components to be inspected.

Abstract: A laser beams inspection apparatus suitable for inspecting electronic components such as ICs mounted on a substrate. The inspection apparatus includes a scan mechanism. The scan mechanism works to move a laser beam emitted from a laser emitter to scan a target one of electronic components in a given scan range. The scan mechanism is designed to change orientation of emission of the laser beam to change the scan range as a function of the type (e.g., the size) of the target electronic component, thereby minimizing inspection errors regardless of the type of the electronic components to be inspected.

Abstract: A wiring pattern inspection apparatus for inspecting an abnormality of a wiring pattern formed on a printed circuit board, which is equipped with an optical image pickup device for optically illuminating a surface of the printed circuit board including the wiring pattern to photoelectrically convert optical information of the printed circuit board surface due to the optical illumination into a grey level image. This grey level image is converted into a bi-level image which separates the grey level image into the wiring pattern side and a background side of the wiring pattern. Thereafter, the bi-level image is once contracted by a first size and then expanded by a second size so as to eliminate a micro conductive portion left on the printed circuit board or a micro pinhole which can be disregarded in the abnormality inspection, thereby preventing the excessive detection.

Abstract: This invention provides a thermocompression bonding equipment which, when the material to be bonded is to be changed, allows easy replacement and preparation of a compression bonding head, reduction of working time required for replacement and preparation of a compression bonding head, and simplified adjustment of the compression bonding head. The thermocompression bonding equipment is provided with a head unit 20 comprising a base 10, thermocompression bonding head 56 and sliding mechanism 50 for sliding the thermocompression bonding head 56 provided on the base 10, pressing means 30, which are structured independently from the head unit, for pressing the sliding mechanism 50 to slide the thermocompression bonding head 56, thereby thermocompression bonding the material of ACF, LCD, and TAB, and a base frame 40 provided with positioning means 40, 41 for positioning the base 10.

Abstract: The exterior view inspecting apparatus for circuit board of the invention including a sensor unit for emitting a laser beam to an object to be inspected, and detecting the displacement of the object by focusing the reflected light on a photoelectric transducer by using a receiving lens; an optical path converter unit for refracting the optical path of the laser beam; a sensor head unit incorporating the sensor unit and optical path converter unit; a control unit for moving the sensor head unit along a specified scanning route; a correction unit for correcting the displacement data of the object to be inspected as detected by the sensor unit, and a judging unit for judging the existence and position of an electronic component on a circuit board from the corrected displacement data. The optical path converter unit includes a flat sheet glass inclined relative to the optical path of the laser beam, rotating about the axial center parallel to the optical path.

Abstract: A wiring pattern inspection apparatus for inspecting an abnormality of a wiring pattern formed on a printed circuit board, which is equipped with an optical image pickup device for optically illuminating a surface of the printed circuit board including the wiring pattern to photoelectrically convert optical information of the printed circuit board surface due to the optical illumination into a grey level image. This grey level image is converted into a bi-level image which separates the grey level image into the wiring pattern side and a background side of the wiring pattern. Thereafter, the bi-level image is once contracted by a first size and then expanded by a second size so as to eliminate a micro conductive portion left on the printed circuit board or a micro pinhole which can be disregarded in the abnormality inspection, thereby preventing the excessive detection.

Abstract: A thermocompression bonding apparatus wherein object parts can be connected with a high degree of accuracy by thermocompression bonding and the entire apparatus is not deformed readily by a high pressure and a member of a large size can be connected at a fine pitch with a high degree of accuracy. The thermocompression bonding apparatus is constructed so as to bond a first member to a second member by thermocompression bonding and comprises a base member, a holding device for holding the second member thereon, a heat generation element for applying heat to the first member, and a pressurization member for pressing the heat generation element against the first member and the second member. The holding device, the heat generation element and the pressurization member are disposed mechanically separately from the base member. Also a thermocompression bonding method and a process of manufacturing a liquid crystal display device which are performed using the thermocompression bonding apparatus are disclosed.

Abstract: Apparatus for feeding electric circuit elements includes a plurality of containers or stockers for electric circuit elements, a transfer member connected to a respective stocker for transferring the circuit elements, and a shutter assembly disposed across the feeding path of the transfer member, whereby a plurality of circuit elements are fed at one time by one stroke of the shutter assembly. The shutter assembly may have a cut-out portion at the edge thereof and is adjustably removable in a direction perpendicular to that of the stroke thereof to open the feeding paths which correspond to the cut-out portion. The stocker may include a receptacle, the bottom of which defines an opening to receive a capture member. The capture member has plural through holes extending axially therethrough and is opened at its conical top thereof to receive circuit elements by reciprocal movement of the capture member relative to the receptacle.

Abstract: An apparatus for feeding electric circuit elements has a hopper for accommodating a supply of such elements, a capture tube or pipe extending substantially vertically through a bore in the bottom of the hopper which is movable relative to the tube in the direction of the axis of the latter so that the electric circuit elements in the hopper are captured one at a time by the tube and fed therethrough to a predetermined position at the outside of the hopper, and a separating plate disposed above the opening of the tube in the hopper for shielding the electric circuit elements under the separating plate from at least part of the weight of the electric circuit elements thereabove whereby the hopper can be provided with a large vertical dimension for accommodating a correspondingly large supply of the electric circuit elements without the danger that elements near the bottom of the hopper will be damaged by reason of the relative movement of the capture tube under the weight of the superposed circuit elements.

Abstract: An apparatus for locating chip type circuit elements on a printed circuit board includes an accommodating assembly for temporarily storing said circuit elements supplied from hoppers, a movable shutter placed under the accommodating assembly, and which supports and rotates circuit elements within the accommodating assembly, and a template placed under the shutter to receive the circuit elements dropped from the accommodating assembly when the shutter is removed laterally from under the accommodating assembly.

Abstract: A hybrid integrated circuit is manufactured byplacing chip-type circuit elements on predetermined portions of a template;preparing a printed circuit board having predetermined conductive patterns thereon and adhesive material at predetermined portions thereof;placing the printed circuit board on the template so as to bring the circuit elements into contact with the adhesive material;turning the template with the circuit board upside down and then transferring the circuit elements to the circuit board by removing the template from the circuit board;hardening the adhesive material to temporarily hold the circuit elements on the circuit board; andsoldering the circuit elements to conductive patterns formed on the circuit board, so as to electrically connect the circuit elements with the conductive patterns.

Abstract: Leadless electronic parts or the like are transferred from hoppers under the influence of gravity or by forced air through tubes of polygonal cross-section to a prepositioning template. The polygonal cross sections of the transferring tubes tend to damp out oscillatory motion of the parts and to speed their travel through the tubes. Each polygonal, preferably triangular, tube is preferably obtained by deforming a tube of circular cross-section in a forming machine including a plurality of discs arranged so that their peripheries define a polygonal space therebetween through which the tube of circular cross section is driven.