Patents by Inventor Iwao Katsuno

Iwao Katsuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9775257
    Abstract: The present invention is an electronic device unit including an electronic device that has air inlets formed on a bottom surface of a main housing body having electronic components housed therein, and that introduces air to an inner part of the main housing body through the air inlets to cool the inner part of the main housing body, and a battery pack that is attached to the main housing body in a state where a battery case covers a part of a portion being an extensional region of the air inlets, wherein a surrounding wall part is provided on the bottom surface of the main housing body to surround a ventilation region in which the air inlets are provided and to be open at a portion facing the ventilation region, and the battery case is attached to the main housing body via protruding ends of the surrounding wall part.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: September 26, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yasuhiro Suzuki, Kenji Kato, Iwao Katsuno
  • Publication number: 20160295719
    Abstract: The present invention is an electronic device unit including an electronic device that has air inlets formed on a bottom surface of a main housing body having electronic components housed therein, and that introduces air to an inner part of the main housing body through the air inlets to cool the inner part of the main housing body, and a battery pack that is attached to the main housing body in a state where a battery case covers a part of a portion being an extensional region of the air inlets, wherein a surrounding wall part is provided on the bottom surface of the main housing body to surround a ventilation region in which the air inlets are provided and to be open at a portion facing the ventilation region, and the battery case is attached to the main housing body via protruding ends of the surrounding wall part.
    Type: Application
    Filed: January 16, 2014
    Publication date: October 6, 2016
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yasuhiro SUZUKI, Kenji KATO, Iwao KATSUNO
  • Patent number: 7986031
    Abstract: A primary molding product is formed by integrally forming a first lead frame and a second lead frame with a primary molding resin portion. In addition, in order to prevent separation of the first lead frame and the second lead frame from the primary molding resin portion, a hook-and-hold portion for preventing separation of the first lead frame from the primary molding resin portion and separation of the second lead frame from the primary molding resin portion is provided on an outer surface of each of the first lead frame and the second lead frame. Thus, a resin molding part capable of achieving suppression of increase in a thickness thereof without deformation or displacement of a lead frame and a manufacturing method thereof can be provided.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: July 26, 2011
    Assignee: Mitsubishi Electric Corporation
    Inventors: Mitsuaki Nakata, Tomonori Abe, Kosei Tsuji, Yuhei Awano, Kazuhiko Yamashita, Hideo Iinuma, Iwao Katsuno, Takayuki Inuzuka, Akihiro Fujita
  • Publication number: 20090206457
    Abstract: A primary molding product is formed by integrally forming a first lead frame and a second lead frame with a primary molding resin portion. In addition, in order to prevent separation of the first lead frame and the second lead frame from the primary molding resin portion, a hook-and-hold portion for preventing separation of the first lead frame from the primary molding resin portion and separation of the second lead frame from the primary molding resin portion is provided on an outer surface of each of the first lead frame and the second lead frame. Thus, a resin molding part capable of achieving suppression of increase in a thickness thereof without deformation or displacement of a lead frame and a manufacturing method thereof can be provided.
    Type: Application
    Filed: February 13, 2009
    Publication date: August 20, 2009
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Mitsuaki NAKATA, Tomonori Abe, Kosei Tsuji, Yuhei Awano, Kazuhiko Yamashita, Hideo Iinuma, Iwao Katsuno, Takayuki Inuzuka, Akihiro Fujita