Patents by Inventor Iwao Nishimura

Iwao Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6837755
    Abstract: A fuse holder component includes a bottom plate fixed to a printed board, and first and second side plates whose main body portions individually extend from side edges of the bottom plate. The second side plate includes a suction portion extending through an extension portion from the main body portion and provided with a suction surface to which a suction nozzle of a mounter is accessible. A pair of fuse holder components, surface-mounted on the printed board by using the mounter, constitute a fuse holder that stably holds a glass-tube fuse.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: January 4, 2005
    Assignee: Kyoshin Kogyo Co., Ltd.
    Inventors: Yoshikazu Kitajima, Iwao Nishimura, Koji Ito
  • Patent number: 6056585
    Abstract: A quick connector includes a contact and a housing fitted thereon. The contact has a first contact piece, a second contact piece which cooperates with the first contact piece to hold a core wire of an electric wire, and leg portions which are electrically connected and mechanically fixed to a circuit board. The housing has a top wall thereof formed with a core-wire insertion hole and rod insertion holes, and a peripheral wall thereof defining therein an accommodation space in which the first and second contact pieces are closely received. The quick connector permits easy insertion of an electric wire thereinto, and adequately maintains electrical connection between itself and an electric wire inserted thereinto. The holding of the electric wire can be released by inserting a releasing rod into either one of the rod insertion holes. The quick connector is suitable to be automatically installed onto a circuit board.
    Type: Grant
    Filed: May 13, 1998
    Date of Patent: May 2, 2000
    Assignee: Kyoshin Kogyo Co., Ltd.
    Inventors: Toshihiro Hatakeyama, Iwao Nishimura, Koji Ito
  • Patent number: 4819717
    Abstract: This invention relates to a novel heat exchanging unit with a hydrogen adsorption alloy of which thermal conductivity is kept high over a long period of use. Particularly in order to solve problems occurring at the time of forming a heat exchanging unit, by forming a compact of a hydrogen adsorption alloy and inserting a heat transfer element in the compact, such as insufficient heat transfer due to a small spacing produced between the compact and the heat transfer element, surface irregularities, decline in function due to micronization and scattering of the compact, difficulty in build-up, etc., there is disclosed a heat exchanging unit comprising a heat transfer element and a hydrogen adsorption alloy fitted to an outer periphery of the heat transfer element and solidly molded.
    Type: Grant
    Filed: April 14, 1986
    Date of Patent: April 11, 1989
    Assignees: Agency of Industrial Science and Technology, Kurimoto Ltd.
    Inventors: Hiroshi Ishikawa, Keisuke Oguro, Hiroshi Suzuki, Akihiko Kato, Teruya Okada, Shizuo Sakamoto, Iwao Nishimura, Keizo Sakaguchi
  • Patent number: 4819718
    Abstract: This invention relates to a novel heat exchanging unit with a hydrogen adsorption alloy of which thermal conductivity is kept high over a long period of use. Particularly in order to solve problems occurring at the time of forming a heat exchanging unit, by forming a compact of a hydrogen adsorption alloy and inserting a heat transfer element in the compact, such as insufficient heat transfer due to a small spacing produced between the compact and the heat transfer element, surface irregularities, decline in function due to micronization and scattering of the compact, difficulty in built-up, etc., there is disclosed a heat exchanging unit comprising a heat transfer element and a hydrogen adsorption alloy fitted to an inner periphery of the heat transfer element and solidly molded.
    Type: Grant
    Filed: April 14, 1986
    Date of Patent: April 11, 1989
    Assignee: Agency of Industrial Science & Technology and Kurimoto Ltd.
    Inventors: Hiroshi Ishikawa, Keisuke Oguro, Hiroshi Suzuki, Akihiko Kato, Teruya Okada, Shizuo Sakamoto, Iwao Nishimura, Keizo Sakaguichi
  • Patent number: 4717629
    Abstract: This invention discloses a compact of hydrogen adsorption alloy principally composed of a metal hydride in which all surfaces of fine particles of hydrogen adsorption alloy are completely coated with a dissimilar metal by plating, without effecting reactivity and a porous material of high thermal conductivity is infiltrated with the fine particles of alloy to be formed into a compact by compression molding.By this construction, it is possible to improve decline in the thermal conductivity or dropping of the fine particles out of cells of the porous material caused by micronization as a result of repeated uses of the hydrogen adsorption alloy are avoided.
    Type: Grant
    Filed: January 28, 1987
    Date of Patent: January 5, 1988
    Assignees: Agency of Industrial Science & Technology, Kurimoto Ltd.
    Inventors: Hiroshi Ishikawa, Keisuke Oguro, Hiroshi Suzuki, Akihiko Kato, Teruya Okada, Shizuo Sakamoto, Iwao Nishimura, Keizo Sakaguchi
  • Patent number: 4609038
    Abstract: This invention discloses a heat exchanger comprising a compact of hydrogen adsorption alloy formed by a process of coating surfaces of fine particles of hydrogen adsorption alloy composed principally of a metal hydride with a dissimilar metal by plating and either by a process of compression molding of the coated alloy or by a process of filling a heat-conductive porous material with the coated fine particles of hydrogen alloy followed by a process of compression molding thereof. By this arrangement, it becomes possible to improve such disadvantages of conventional heat exchanger using hydrogen adsorption alloy as a decline of heat conductivity caused by micronization of the hydrogen adsorption alloy as a result of repeated uses or a decline of filling rate of the alloy caused by collapse and dispersion of the fine particles of the alloy compact eventually bringing about a decline of the heat exchanging function.
    Type: Grant
    Filed: July 24, 1985
    Date of Patent: September 2, 1986
    Assignees: Agency of Industrial Science & Technology, Kurimoto, Ltd.
    Inventors: Hiroshi Ishikawa, Keisuke Oguro, Hiroshi Suzuki, Akihiko Kato, Teruya Okada, Shizuo Sakamoto, Iwao Nishimura, Keizo Sakaguchi
  • Patent number: D517504
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: March 21, 2006
    Assignee: Kyoshin Kogyo Co., Ltd.
    Inventors: Yoshikazu Kitajima, Iwao Nishimura, Koji Ito