Abstract: A first negotiation (142) is performed between a first agent (112) and a second agent (122). Responsive to the outcome of the first negotiation (142), a first asset is selectively purchased from the second agent (122). A second negotiation (148) is performed with a third agent (136), and, responsive to the outcome of the second negotiation (148), a second asset controlled by the first agent (112) is selectively sold to the third agent (136).

Abstract: A system for generating a user activity feedback comprises a sensor device (101) and a user device (103). The sensor device (101) comprises a force sensor (105, 107) which determines a measured force distribution resulting from a user activity, such as a sporting or exercise activity. A transmitter (109) transmits the measured force distribution to the user device (103) where a receiver (111) receives the measured force distribution. A context data processor (115) provides context data for the user, such as e.g. environment data or activity equipment data. A target processor (117) determines a target force distribution for the user activity in response to the context data and a feedback processor (113) generates the user activity feedback in response to the measured force distribution and the target force distribution. The user device can then present the user activity feedback to the user, e.g. as a real time audio signal suggesting performance corrections that can be made by the user.

Abstract: A printed multilayer electronic circuit has printed electronic components on a first level circuit. Electrical conductors are printed on the first level circuit, electrically connected to the electronic components. A layer of dielectric material is printed over the printed electrical conductors. The dielectric layer contains apertures or openings that extend vertically through the dielectric layer down to the electrical conductors. A second set of electrical conductors are then printed on the dielectric layer, situated around the apertures. Electrically conductive material is printed in the apertures so that an electrical connection is made from the second set of electrical conductors to the electrical conductors on the lower level.

Abstract: A wireless communication device (102) includes a multi-mode transceiver (204) that is operable to communicate with a plurality of communication networks. The device (102) also includes a memory (216) for storing: an electronic address book (226) that includes a plurality of identifiers (302), each identifier (302) identifying a call destination device; a plurality of access network choices (304) for at least one of the identifiers (302); and a plurality of service choices (308) for at least one of the identifiers. The device (102) further includes a controller (210) having access to the memory (216) for determining a preferred call model and selecting one of the plurality of access network choices and one of the plurality of service choices as a preferred call model for at least one of the identifiers.

Abstract: Displays such as liquid crystal displays (10), organic light emitting diode displays, and touch sensitive displays (41) are stacked with one or more solar cells (15) such that light passing through the displays will illuminate the light receiving active surface of the solar cells (15). No reflector or polarizer need be used when the liquid crystal display (10) uses cholesteric or polymer dispersed liquid crystals. When using supertwist nematic or twisted nematic liquid crystals, a reflector (21) can be used that comprises a selective color reflector. The resultant display/solar cell can be utilized in combination with a device such as a wireless communications device (62) with the solar cell (15) providing electricity to the display (61), the wireless communications device (62), or both. A mask (71) can be used to occlude surface features on the solar cell (15) as appropriate to provide a substantially uniformly colored appearance.

Abstract: A plurality of sensor clusters are provided (61) wherein at least some of the sensor clusters are comprised of at least one light sensitive sensor and a plurality of light emitters. These sensor clusters are disposed (62) in close proximity to a subject user and, in a preferred approach, at least some of the sensor clusters are disposed substantially distal to one another. The light emitters are caused (63) to emit light and the light sensitive sensors are used (64) to detect interactions as between the subject user and the emitted light. These detected interactions are then used (65) to determine the user's heart rate. In a preferred embodiment, the sensed interaction information is dynamically modified as a reflection of how valid the information trajectory appears to be at any given time.

Abstract: Liquid crystal displays (10) and touch sensitive displays (41) are stacked with one or more solar cells (15) such that light passing through the displays will illuminate the light receiving active surface of the solar cells (15). No reflector or polarizer need be used when the liquid crystal display (10) uses cholesteric or polymer dispersed liquid crystals. When using supertwist nematic or twisted nematic liquid crystals, a reflector (21) can be used that comprises a selective color reflector. The resultant display/solar cell can be utilized in combination with a device such as a wireless communications device (62) with the solar cell (15) providing electricity to the display (61), the wireless communications device (62), or both. A mask (71) can be used to occlude surface features on the solar cell (15) as appropriate to provide a substantially uniformly colored appearance.

Abstract: Brain response signals of a user, such as electroencephalogram signals, and in particular visually evoked potential signals that correspond to predetermined illumination patterns, are detected and utilized to ascertain selection of specific functions and/or actions as desired by that user. Sources of illumination that exhibit such patterns are arranged to physically correspond to indicia of such functions and actions to facilitate knowing selection thereof.

Abstract: An eye implant for treating glaucoma includes a main conduit and a plurality of anchor members formed from a first resilient material. The anchor members are formed such that they are biased to a relaxed condition in a non-aligned position relative to the conduit. To facilitate insertion of the implant into the eye in a minimally invasive surgical procedure, the anchor members are secured together in an aligned condition relative to the conduit with a bonding material. A cutting surface or element is also applied to the anchor members to allow the implant to be inserted directly through the wall of the sclera. The cutting surface is formed of a second material different from the first material. The second material is adapted to dissolve or melt after the implant has been inserted into the eye.

Abstract: Brain response signals of a user, such as electroencephalogram signals, and in particular visually evoked potential signals that correspond to predetermined illumination patterns, are detected and utilized to ascertain selection of specific functions and/or actions as desired by that user. Sources of illumination that exhibit such patterns are arranged to physically correspond to indicia of such functions and actions to facilitate knowing selection thereof.

Abstract: Displays such as liquid crystal displays (10), organic light emitting diode displays, and touch sensitive displays (41) are stacked with one or more solar cells (15) such that light passing through the displays will illuminate the light receiving active surface of the solar cells (15). No reflector or polarizer need be used when the liquid crystal display (10) uses cholesteric or polymer dispersed liquid crystals. When using supertwist nematic or twisted nematic liquid crystals, a reflector (21) can be used that comprises a selective color reflector. The resultant display/solar cell can be utilized in combination with a device such as a wireless communications device (62) with the solar cell (15) providing electricity to the display (61), the wireless communications device (62), or both. A mask (71) can be used to occlude surface features on the solar cell (15) as appropriate to provide a substantially uniformly colored appearance.

Abstract: A self-contained remotely interrogated biomedical sensor (10) includes an on-board regenerative power source (52/54), data processing capability (42) and data transmission capability (42). The sensor (10) is adapted to be secured to a subject and interrogated remotely using radio-frequency technology. The present invention is applicable for use with any sensing device (76) that is capable of providing a signal in response to being placed in thermal, electrical, chemical, acoustical or otherwise in contact with the subject.

Abstract: A microelectronic package (10) is formed by placing a lead frame (22) onto an adhesive polyimide tape (38). The lead frame (22) includes a plurality of metallic leads (16) and an opening. An integrated circuit die (12) is positioned onto the molding support (38) within the opening such that a non-active face (32) of the integrated circuit die (12) rests against the molding support (38). Wire leads (18) connect an active face (28) of the integrated circuit die (12) to the metallic leads (16). A plurality of metallic bumps (20) are attached to the metallic leads (16), and a polymeric precursor is dispensed. The precursor embeds the active face (28) of the integrated circuit die (12), the inner surface (19) of the metallic leads (16), the wire leads (18), and the metallic bumps (20). The microelectronic package (10) is then heated to cure the polymeric precursor to form a polymeric body (14).

Abstract: A microelectronic assembly (10) includes a polymeric card (12) that includes a substantially planar major surface (18). An integrated circuit component (14) is embedded in the polymeric card (12) and has a first contact (20) and a second contact (22). An antenna element (16) is formed of a singular metallic strip and includes a first terminal (26) electrically connected to the first contact (20), a second terminal (28) electrically connected to the second contact (22), and a loop (30) intermediate the first terminal (26) and the second terminal (28). The first terminal (26) includes a first outer surface (32) and the second terminal (28) includes a second outer surface (34). The first outer surface (32) and the second outer surface (34) are exposed at the major surface (18) and are coextensive therewith. The loop (30) is embedded within the polymeric card (12) and spaced apart from the major surface (18).

Abstract: A multichip module having high density optical and electrical interconnections between integrated circuit chips includes a substrate overlaying an array of integrated circuit chips. An optical transmitter generates a first optical beam through the substrate and an optical detector receives a second optical beam through the substrate. A hologram is positioned in the path of at least one of the first and second optical beams. An array of electrical contact pads is located on the substrate corresponding to the array of electrical contact pads on the respective integrated circuit chips. A pattern of electrical interconnection lines is located on the substrate for electrically interconnecting the integrated circuit chips. A solder bump between electrical contact pads on the substrate and on the integrated circuit chips establish electrical connections between the substrate and the integrated circuit chips, and also facilitate alignment of the integrated circuit chips with respect to the substrate.

Abstract: A microelectronic package (10) is formed by placing a lead frame (22) onto an adhesive polyimide tape (38). The lead frame (22) includes a plurality of metallic leads (16) and an opening. An integrated circuit die (12) is positioned onto the molding support (38) within the opening such that a non-active face (32) of the integrated circuit die (12) rests against the molding support (38). Wire leads (18) connect an active face (28) of the integrated circuit die (12) to the metallic leads (16). A plurality of metallic bumps (20) are attached to the metallic leads (16), and a polymeric precursor is dispensed. The precursor embeds the active face (28) of the integrated circuit die (12), the inner surface (19) of the metallic leads (16), the wire leads (18), and the metallic bumps (20). The microelectronic package (10) is then heated to cure the polymeric precursor to form a polymeric body (14).

Abstract: A multichip module having high density optical and electrical interconnections between integrated circuit chips includes a substrate overlaying an array of integrated circuit chips. An optical transmitter generates a first optical beam through the substrate and an optical detector receives a second optical beam through the substrate. A hologram is positioned in the path of at least one of the first and second optical beams. An array of electrical contact pads is located on the substrate corresponding to the array of electrical contact pads on the respective integrated circuit chips. A pattern of electrical interconnection lines is located on the substrate for electrically interconnecting the integrated circuit chips. A solder bump between electrical contact pads on the substrate and on the integrated circuit chips establish electrical connections between the substrate and the integrated circuit chips, and also facilitate alignment of the integrated circuit chips with respect to the substrate.

Abstract: A temporary substrate for solder bumps may be used to transfer solder bumps to a microelectronic device. The temporary substrate includes a solder nonwettable surface and a plurality of conductive vias therein. A solder bump is formed on each of the conductive vias and is electrically and mechanically connected thereto. The solder bump extends over the solder nonwettable surface to produce a solder bump cross-sectional area which is greater than the cross-sectional area of the conductive via. A microelectronic device is placed adjacent the temporary substrate with each input/output pad adjacent a respective solder bump. An electrical and mechanical connection is formed between the solder bump and the input/output pad, and the microelectronic device is separated from the temporary substrate with the solder bump remaining connected to the input/output pad. The temporary substrate can also be used for burn-in and testing of microelectronic devices and rework on multichip modules.

Abstract: An integrated circuit chip having solder bumps thereon may be tested using a temporary substrate having substrate pads corresponding to locations of the input/output pads on the chip and having a sacrificial conductor layer on the temporary substrate pads. The solder bumps are placed adjacent the corresponding sacrificial metal layer and heated to form an electrical and mechanical connection between the chip and the temporary substrate. The chip is then tested and/or burned-in on the temporary substrate. After testing/burn-in, the sacrificial metal layer is dissolved into the solder bumps by heating. The integrated circuit chip, including a solder bump having the dissolved sacrificial metal layer therein, may be easily removed from the temporary substrate. Solder bumps may also be formed on the temporary substrate and transferred to unbumped chips.

Abstract: An integrated circuit chip having solder bumps thereon may be tested using a temporary substrate having substrate pads corresponding to locations of the input/output pads on the chip and having a sacrificial conductor layer on the temporary substrate pads. The solder bumps are placed adjacent the corresponding sacrificial metal layer and heated to form an electrical and mechanical connection between the chip and the temporary substrate. The chip is then tested and/or burned-in on the temporary substrate. After testing/burn-in, the sacrificial metal layer is dissolved into the solder bumps by heating. The integrated circuit chip, including a solder bump having the dissolved sacrificial metal layer therein, may be easily removed from the temporary substrate. Solder bumps may also be formed on the temporary substrate and transferred to unbumped chips.