Patents by Inventor Iyoel Beniam

Iyoel Beniam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device by laser-induced forming and transfer of shaped metallic interconnects
    Patent number: 10297565
    Abstract: An electronic device made from the method of providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, laser bending the shaped metallic interconnects; and transferring the shaped metallic interconnects onto a receiving substrate or device.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: May 21, 2019
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventors: Scott A. Mathews, Iyoel Beniam, Alberto Piqué
  • Electronic Device By Laser-Induced Forming and Transfer of Shaped Metallic Interconnects
    Publication number: 20180240772
    Abstract: An electronic device made from the method of providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, laser bending the shaped metallic interconnects; and transferring the shaped metallic interconnects onto a receiving substrate or device.
    Type: Application
    Filed: April 25, 2018
    Publication date: August 23, 2018
    Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Scott A. Mathews, Iyoel Beniam, Alberto Piqué
  • Laser-induced forming and transfer of shaped metallic interconnects
    Patent number: 9966356
    Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: May 8, 2018
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventors: Scott A. Mathews, Iyoel Beniam, Alberto Piqué
  • Laser-Induced Forming and Transfer of Shaped Metallic Interconnects
    Publication number: 20170221851
    Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.
    Type: Application
    Filed: April 18, 2017
    Publication date: August 3, 2017
    Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Scott A. Mathews, Iyoel Beniam, Alberto Piqué
  • Laser-induced forming and transfer of shaped metallic interconnects
    Patent number: 9685349
    Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: June 20, 2017
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventors: Scott A. Mathews, Iyoel Beniam, Alberto Piqué
  • Laser-Induced Forming and Transfer of Shaped Metallic Interconnects
    Publication number: 20170103902
    Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.
    Type: Application
    Filed: June 10, 2016
    Publication date: April 13, 2017
    Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Scott A. Mathews, Iyoel Beniam, Alberto Piqué