Patents by Inventor Izabela Samek

Izabela Samek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250221023
    Abstract: Integrated circuit structures having backside contact extensions are described. In an example, a structure includes a first and second pluralities of horizontally stacked nanowires or fins. First and second gate stacks are over the first and second pluralities of horizontally stacked nanowires or fins. An epitaxial source or drain structure is between the first and second pluralities of horizontally stacked nanowires or fin. A dielectric structure is over the first gate stack, over the second gate stack, and over the epitaxial source or drain structure, the dielectric structure having an opening over the epitaxial source or drain. A conductive structure is in the opening in the dielectric structure and on the epitaxial source or drain structure, the conductive structure having a top surface below a top of the opening. A conductive extension is on the conductive structure, the conductive extension in and protruding above the opening in the dielectric structure.
    Type: Application
    Filed: December 28, 2023
    Publication date: July 3, 2025
    Inventors: Leonard P. GULER, Jeffrey S. LEIB, Baofu ZHU, Vishal TIWARI, Izabela SAMEK, Shengsi LIU
  • Publication number: 20240241446
    Abstract: Apparatus and methods are disclosed. An example lithography apparatus includes an ultraviolet (UV) source to expose a photoresist layer to UV light; and an extreme ultraviolet (EUV) source coupled to the UV source, the EUV source to expose the photoresist layer to EUV light to via a photomask, a combination of the UV light and the EUV light provide a pattern on the photoresist layer when a developer solution is applied to the photoresist layer.
    Type: Application
    Filed: March 28, 2024
    Publication date: July 18, 2024
    Inventors: Marvin Paik, Charles H. Wallace, Leonard Guler, Elliot N. Tan, Shengsi Liu, Vivek Vishwakarma, Izabela Samek, Mohammadreza Soleymaniha