Abstract: A method of adjusting a sensitivity parameter value for substrate defect inspection used in a substrate defect inspection apparatus compares, for each pixel value of a selected virtual inspection substrate, using reference pixel data to be used after adjustment, the deviation amount from an allowable range corresponding to the position thereof and the sensitivity parameter value before the adjustment when each pixel value is deviated from the allowable range, and updates the deviation amount as a new sensitivity parameter value when the deviation amount exceeds the sensitivity parameter value and a difference between the deviation amount and the sensitivity parameter value is equal to or less than a threshold value.

Abstract: A method of adjusting a sensitivity parameter value for substrate defect inspection used in a substrate defect inspection apparatus compares, for each pixel value of a selected virtual inspection substrate, using reference pixel data to be used after adjustment, the deviation amount from an allowable range corresponding to the position thereof and the sensitivity parameter value before the adjustment when each pixel value is deviated from the allowable range, and updates the deviation amount as a new sensitivity parameter value when the deviation amount exceeds the sensitivity parameter value and a difference between the deviation amount and the sensitivity parameter value is equal to or less than a threshold value.

Abstract: In one embodiment, a liquid treatment method includes (A) imaging a discharging port part of the liquid nozzle each time the discharging process is performed to one substrate, and acquiring, from images thus obtained, size data on foreign matter possibly present at the discharging port part; and (B) based on a history of the size data arranged in chronological order, judging whether an abnormality in substrate-processing has occurred. In the item (B), if the number of continuous acquisition, indicating how many times the size data not smaller than a first threshold value has been acquired continuously, exceeds a predetermined value, then judging that an abnormality in substrate-processing has occurred.

Abstract: An electrical connector is provided with a first ground contact and a second ground contact. The first ground contact includes a first ground coupling portion and a pair of first ground contact portions extending substantially orthogonal from the first ground coupling portion. The pair of first ground contact portions includes a first upper ground contact portion stepped from a first lower ground contact portion. The second ground contact includes a second ground coupling portion and a pair of second ground contact portions extending substantially orthogonal from the second ground coupling portion. The pair of second ground contact portions includes a second upper ground contact portion stepped from a second lower ground contact portion. The second ground contact is positioned with the first ground contact such that their respective upper or lower ground contact portions are adjacent to each other.

Abstract: A potential trouble can be in advance suppressed by analyzing a defect of a wafer. A defect analyzing apparatus of analyzing a defect of a substrate includes an imaging unit configured to image target substrates; a defect feature value extracting unit configured to extract a defect feature value in a surface of the substrate based on the substrate image; a defect feature value accumulating unit configured to calculate an accumulated defect feature value with respect to the substrates to create an accumulation data AH; a defect determination unit configured to determine whether the accumulated defect feature value exceeds a preset critical value; and an output display unit configured to output a determination result from the defect determination unit.

Abstract: An electrical connector is provided with a first ground contact and a second ground contact. The first ground contact includes a first ground coupling portion and a pair of first ground contact portions extending substantially orthogonal from the first ground coupling portion. The pair of first ground contact portions includes a first upper ground contact portion stepped from a first lower ground contact portion. The second ground contact includes a second ground coupling portion and a pair of second ground contact portions extending substantially orthogonal from the second ground coupling portion. The pair of second ground contact portions includes a second upper ground contact portion stepped from a second lower ground contact portion. The second ground contact is positioned with the first ground contact such that their respective upper or lower ground contact portions are adjacent to each other.

Abstract: An electrical connector is disclosed having a plurality of contacts. The plurality of contacts includes contact ends positioned in two rows and terminating ends positioned in one row. A first grouping of the plurality of contacts includes units of two differential signal carrying contacts having signal carrying contact ends connected to two signal terminating ends on a one to one ratio. The first grouping also includes grounding contacts positioned adjacent to the signal carrying contacts, and having grounding contact ends connected to grounding terminating ends with a ratio of the number of grounding contact ends being greater than or equal to the number of grounding terminating ends.

Abstract: In the present invention, a planar distribution of pixel values in a picked-up substrate image is decomposed into a plurality of pixel value distribution components through use of a Zernike polynomial for each of substrate images; Zernike coefficients of the pixel value distribution components decomposed through use of the Zernike polynomial are calculated; a median value and values deviated from the median value by a predetermined value or more are extracted for every Zernike coefficients having a same couple of degrees from the calculated Zernike coefficients; substrate images having the extracted values are specified; and a substrate image being a defect inspection reference is created by combining the specified substrate images.

Abstract: In one embodiment, a liquid treatment method includes (A) imaging a discharging port part of the liquid nozzle each time the discharging process is performed to one substrate, and acquiring, from images thus obtained, size data on foreign matter possibly present at the discharging port part; and (B) based on a history of the size data arranged in chronological order, judging whether an abnormality in substrate-processing has occurred. In the item (B), if the number of continuous acquisition, indicating how many times the size data not smaller than a first threshold value has been acquired continuously, exceeds a predetermined value, then judging that an abnormality in substrate-processing has occurred.

Abstract: An electrical connector including a housing having a mating connector receiving passageway. A pair of first differential signal contacts have solder portions and first contact portions positioned in the mating connector receiving passageway. A first ground contact faces the pair of first differential signal contacts. The first ground contact has a solder portion and a pair of first grounding contact portions spaced apart from each other by a gap and positioned in the mating connector receiving passageway. The pair of first grounding contact portions face the first contact portions of the pair of first differential signal contacts.

Abstract: A potential trouble can be in advance suppressed by analyzing a defect of a wafer. A defect analyzing apparatus of analyzing a defect of a substrate includes an imaging unit configured to image target substrates; a defect feature value extracting unit configured to extract a defect feature value in a surface of the substrate based on the substrate image; a defect feature value accumulating unit configured to calculate an accumulated defect feature value with respect to the substrates to create an accumulation data AH; a defect determination unit configured to determine whether the accumulated defect feature value exceeds a preset critical value; and an output display unit configured to output a determination result from the defect determination unit.

Abstract: An electrical connector including a housing having a mating connector receiving passageway. A pair of first differential signal contacts have solder portions and first contact portions positioned in the mating connector receiving passageway. A first ground contact faces the pair of first differential signal contacts. The first ground contact has a solder portion and a pair of first grounding contact portions spaced apart from each other by a gap and positioned in the mating connector receiving passageway. The pair of first grounding contact portions face the first contact portions of the pair of first differential signal contacts.

Abstract: An electrical connector is disclosed having a plurality of contacts. The plurality of contacts includes contact ends positioned in two rows and terminating ends positioned in one row. A first grouping of the plurality of contacts includes units of two differential signal carrying contacts having signal carrying contact ends connected to two signal terminating ends on a one to one ratio. The first grouping also includes grounding contacts positioned adjacent to the signal carrying contacts, and having grounding contact ends connected to grounding terminating ends with a ratio of the number of grounding contact ends being greater than or equal to the number of grounding terminating ends.

Abstract: The present invention is a substrate treatment apparatus for performing solution treatment on a substrate, performing post-treatment in a treatment module subsequent to the solution treatment, including: a solution treatment section including a plurality of nozzles prepared for respective kinds of treatment solutions corresponding to lots of substrates; a transfer mechanism for transferring the substrate; a monitoring section monitoring whether there is a failure in discharge of the treatment solution in the nozzle; and a control unit outputting a control signal to prohibit the solution treatment in the solution treatment section for a substrate scheduled to be treated using a nozzle determined to have a failure by the monitoring section and to perform the solution treatment in the solution treatment section for a substrate scheduled to be treated using a nozzle other than the nozzle determined to have a failure.

Abstract: In the present invention, a planar distribution of pixel values in a picked-up substrate image is decomposed into a plurality of pixel value distribution components through use of a Zernike polynomial for each of substrate images; Zernike coefficients of the pixel value distribution components decomposed through use of the Zernike polynomial are calculated; a median value and values deviated from the median value by a predetermined value or more are extracted for every Zernike coefficients having a same couple of degrees from the calculated Zernike coefficients; substrate images having the extracted values are specified; and a substrate image being a defect inspection reference is created by combining the specified substrate images.

Abstract: The present invention is a substrate treatment apparatus for performing solution treatment on a substrate, performing post-treatment in a treatment module subsequent to the solution treatment, including: a solution treatment section including a plurality of nozzles prepared for respective kinds of treatment solutions corresponding to lots of substrates; a transfer mechanism for transferring the substrate; a monitoring section monitoring whether there is a failure in discharge of the treatment solution in the nozzle; and a control unit outputting a control signal to prohibit the solution treatment in the solution treatment section for a substrate scheduled to be treated using a nozzle determined to have a failure by the monitoring section and to perform the solution treatment in the solution treatment section for a substrate scheduled to be treated using a nozzle other than the nozzle determined to have a failure.

Abstract: A surface mount type connector includes a housing, contacts and solder pieces. The contacts are secured to the housing and the solder pieces are secured to respective contacts. The solder pieces include flat sections that form a common plane across the contacts.

Abstract: The invention provides an electrical connector assembly that is constituted by a first connector and a second connector, each of the first and second connectors having signal contacts disposed in two rows, a grounding member disposed between the rows of signal contacts and a housing that holds the signal contacts and the grounding member and being engaged with each other, and an electrical connector that constitutes the electrical connector assembly. The electrical connector and electrical connector assembly increase the reliability of a grounding path, require only a small number of component parts and are suitable for high-speed signal transmission. A first grounding plate and a second grounding plate that constitute the grounding member are disposed in the immediate vicinity of rows of signal contacts that are disposed in two rows and the housing has a through opening. Therefore, a connection section that constitutes the grounding member can be visually checked.

Abstract: The invention provides an electrical connector assembly that is constituted by a first connector and a second connector, each of the first and second connectors having signal contacts disposed in two rows, a grounding member disposed between the rows of signal contacts and a housing that holds the signal contacts and the grounding member and being engaged with each other, and an electrical connector that constitutes the electrical connector assembly. The electrical connector and electrical connector assembly increase the reliability of a grounding path, require only a small number of component parts and are suitable for high-speed signal transmission. A first grounding plate and a second grounding plate that constitute the grounding member are disposed in the immediate vicinity of rows of signal contacts that are disposed in two rows and the housing has a through opening. Therefore, a connection section that constitutes the grounding member can be visually checked.