Abstract: Provided is a laser processing method for performing laser processing on a printed circuit board by using a carbon dioxide laser oscillator that oscillates a laser by applying an RF pulse, including continuing laser oscillation by restarting an RF pulse application while a laser after completing the RF pulse application is output, cutting off the continuously oscillated laser for a desired time, and performing laser processing on the printed circuit board.

Abstract: A laser processing method includes providing a unit configured to obtain time t0 from a time when the high-frequency pulse RF output is turned on to a time when the laser is actually output in advance and change a traveling direction of the laser in an optical path of the laser, irradiating the workpiece with all the lasers while the high-frequency pulse RF output is turned on, and removing at least a part of the laser from the workpiece simultaneous with turning off the high-frequency pulse RF output.

Abstract: A multi-axis laser machine in which the working efficiency can be improved even when machining positions in respective systems are different from each other. The positioning operation of a laser positioning unit for positioning an optical path of a laser beam in an axis and the positioning operation of another laser positioning unit for positioning another optical path of the laser beam in another axis are performed independently of each other. An arbitration unit monitors the laser positioning units as to whether they have finished positioning or not. The arbitration unit operates a deflection unit (AOM) so as to supply the laser beam to one of the laser positioning units which has finished positioning. Incidentally, when the laser positioning units finish positioning simultaneously, the arbitration unit supplies the laser beam to the laser positioning units in a predetermined sequence.

Abstract: A multi-axis laser machine in which the working efficiency can be improved even when machining positions in respective systems are different from each other. The positioning operation of a laser positioning unit for positioning an optical path of a laser beam in an axis and the positioning operation of another laser positioning unit for positioning another optical path of the laser beam in another axis are performed independently of each other. An arbitration unit monitors the laser positioning units as to whether they have finished positioning or not. The arbitration unit operates a deflection unit (AOM) so as to supply the laser beam to one of the laser positioning units which has finished positioning. Incidentally, when the laser positioning units finish positioning simultaneously, the arbitration unit supplies the laser beam to the laser positioning units in a predetermined sequence.

Abstract: There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.