Patents by Inventor Izumi Hayakawa

Izumi Hayakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11939443
    Abstract: A polyphenylene ether resin composition includes (A) polyphenylene ether, and (B) a block copolymer including a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. The number average molecular weight (Mn) of the component (A) may be 1,000 to 7,000, the weight ratio of the styrene block to the butadiene block in the component (B) may be 10:90 to 80:20, and the weight average molecular weight (Mw) of the component (B) may be 2,000 to 100,000.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: March 26, 2024
    Assignee: NIPPON SODA CO., LTD.
    Inventors: Shota Osumi, Izumi Tando, Hiroki Ueda, Yoshio Hayakawa
  • Patent number: 7161618
    Abstract: A camera system includes a camera for photographing an object and acquiring image data of the object, and a computer connectable to the camera. The camera is provided with a manipulation member and a camera controller for detecting an operation of the manipulation member and transmitting a signal based on the detected results to the computer. The computer is provided with a controller for controlling a screen of a display functioning together with the computer based on the signal received from the camera.
    Type: Grant
    Filed: March 18, 1999
    Date of Patent: January 9, 2007
    Assignee: Minolta Co., Ltd.
    Inventors: Masahito Niikawa, Kenji Nakamura, Izumi Hayakawa
  • Patent number: 5011510
    Abstract: A composite abrasive-articles according to the present invention is obtained by: mixing diamond pieces of abrasive articles or cubic boron nitride pieces of abrasive articles and metal powder, molding this mixture into a uniformed small piece of abrasive articles, then or simultaneously with this molding, completely sintering the uniform small piece of abrasive articles after the molding, and mixing the completely sintered piece of abrasive articles after the sintering with resin, metal or glass of a low melting point so as to be solidified into a predetermined shape. In the composite abrasive-article of this type, the completely sintered piece of abrasion articles made of the diamond pieces of abrasion articles or cubic boron nitride piece of abrasive articles and metal powder is dispersed and solidified in a matrix made of either resin, metal, or glass having a low melting point. The composite abrasive-articles are preferably used for grinding, polishing, and/or cutting metal, ceramics, stone, or the like.
    Type: Grant
    Filed: September 21, 1989
    Date of Patent: April 30, 1991
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Izumi Hayakawa, Hiroshi Soboi
  • Patent number: 4439237
    Abstract: A metallurgically bonded diamond-metal composite sintered material suitable for lapping comprises a Ni and/or Co base, an intermetallic compound dispersed in said base and diamond powder, and the method of making said material comprises specifying the particle size of the base powder and then sintering same at a low temperature not exceeding a diamond graphitization temperature.
    Type: Grant
    Filed: September 25, 1981
    Date of Patent: March 27, 1984
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Shiro Kuminitsu, Izumi Hayakawa, Seizo Kitatani, Akira Emura
  • Patent number: 4362535
    Abstract: This invention provides a metal bonded diamond abrasive article of nickel-copper basis. The sintered metal bond, which consists essentially of 2 to 30% by weight of copper, 1 to 40% by weight of tin, 0.2 to 3% by weight of phosphorous, and at least 50% by weight of the remainder nickel, well disperses and retains diamond grits and minimizes the clogging and the variation in rate of stock removal.
    Type: Grant
    Filed: June 9, 1981
    Date of Patent: December 7, 1982
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Eiji Isobe, Izumi Hayakawa, Akira Emura