Abstract: In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case body 41 so as to surround case body 41. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.

Abstract: A vehicle passenger restraining system comprises a knee bolster, a bolster movement structure, a collision detecting section and a control section. The knee bolster is disposed in a front portion of a seat in a vehicle. The bolster movement structure is coupled to the knee bolster to apply a rearwardly directed pulling force to each transverse end of the knee bolster. The collision detecting section is configured and arranged to detect information relating to a collision of the vehicle and a probability of a collision of the vehicle. The control section is configured to operate the bolster movement structure based on the information from the collision detecting section.

Abstract: An impact energy absorbing knee bolster system is basically provided with a load input part and a deformation accepting structure. The load input part is arranged to contact a passenger's knee during a collision. The deformation accepting structure is located between a load input part and a vehicle structural member to deform in response to an impact load imparted by the passenger's knee during a collision. The deformation accepting structure includes a plurality of collapsing parts forming wedge-shaped spaces between each of the collapsing parts and the load input part. Each of the collapsing parts has an inflection point with a longitudinal position between a forward end and a rearward end with the longitudinal positions of the inflection points being different for an upper one of the collapsing parts than for a lower one of the collapsing parts.

Abstract: In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.

Abstract: An impact energy absorbing knee bolster system is basically provided with a lateral offset input restriction structure and a vertical offset input absorption structure. The lateral offset input restriction structure restricts a lateral offset input component of an impact load imparted by a passenger's knee against the knee bolster to lateral direction and promotes deformation of the knee bolster during a collision. The vertical offset input absorption structure absorbs a vertical offset input component of the impact load imparted by the passenger's knee against the knee bolster and to promote deformation of the knee bolster during the collision.

Abstract: A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

Abstract: In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.

Abstract: In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case body 41 so as to surround case body 41. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.

Abstract: In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.

Abstract: A camera module includes a module structure constituted by a lens unit to which an image pickup lens is attached and a package to which an imaging element is attached so as to be opposite to the image pickup lens. An optical filter is arranged between the imaging element and the image pickup lens. A portion of a flat surface of the optical filter is fixed to a filter fixing portion via an adhesive. The optical filter is adhered to the filter fixing portion in a state in which an end portion formed by a side surface of the optical filter and the flat surface is in noncontact with the filter fixing portion or the adhesive. Minute particles generated from a cut surface of the optical filter fall outside the filer fixing portion.

Abstract: A vehicle passenger restraining system comprises a knee bolster, a bolster movement structure, a collision detecting section and a control section. The knee bolster is disposed in a front portion of a seat in a vehicle. The bolster movement structure is coupled to the knee bolster to apply a rearwardly directed pulling force to each transverse end of the knee bolster. The collision detecting section is configured and arranged to detect information relating to a collision of the vehicle and a probability of a collision of the vehicle. The control section is configured to operate the bolster movement structure based on the information from the collision detecting section.

Abstract: A vehicle headrest apparatus has a headrest unit mounted to an upper end of a seatback. The headrest unit has a headrest members with a head restraining member configured to be tensioned to restrain a passenger's head upon a rear-end collision. The headrest unit quickly and reliably restrains a seated passenger's head during a rear-end collision without utilizing the inertia force of the passenger's body by detecting the rear-end collision and pushing the headrest unit only outward in the forward direction of the vehicle. The headrest unit also has a swing/pushup device that to pushes the headrest members upwardly and forwardly. An auxiliary swing force adding device applies an auxiliary spring force in the deployment direction of the headrest members to increase the deployment speed of the headrest members and shorten the amount of time required to achieve initial contact between the passenger's head H and the head restraining member.

Abstract: An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light receiving element, and resin provided to at least the periphery of the plate-like transparent member. The plate-like transparent member includes a first principal plane positioned on the light receiving element side and a second principal plane opposite the first principal plane. The first principal plane is greater in area than the second principal plane.

Abstract: An image pickup device is disclosed that has little deformation caused by thermal expansion of a transparent resin for sealing an image pickup element. The image pickup device includes an image pickup element having a light receiving surface, a micro-lens for condensing incident light to the image pickup element, a first transparent plate disposed on the light receiving surface of the image pickup element with the micro-lens in between, a transparent resin that seals the image pickup element and the first transparent plate, and a second transparent plate disposed on the transparent resin to face the first transparent plate.

Abstract: A vehicle headrest apparatus includes a headrest member including a head restraint section to restrain the head of a seat occupant; and a forward move mechanism to move the head restraint section forward in case of a rear end collision of a vehicle. There is further provided an inclining mechanism to incline the head restraint section forward during a forward movement of the head restraint section, by increasing an amount of a forward movement of an upper part of the head restraint section greater than an amount of a forward movement of a lower part of the head restraint section.

Abstract: A vehicle headrest apparatus has a headrest unit that is mounted to an upper end of a seatback. The headrest unit has a head restraining member with a flexible sheet restraining member configured to be tensioned to restrain a passenger's head when a controller detects a rear-end collision. The head restraining member has a vertical support portion facing the head of the passenger and a horizontal support portion substantially perpendicular to an upper part of the vertical support portion. When a rear-end collision occurs, tension is applied to at least the vertical support portion. In some embodiments, the vertical and horizontal support portions are both formed by the flexible sheet restraining member. In other embodiments, only the vertical support portion is partially formed by the flexible sheet restraining member, and the vertical and horizontal support portions are made of a resilient material having an excellent shape-retaining property.

Abstract: This invention controls the signal amplification rate in a simple way with high precision in a CMD or CMD-carrying CCD device. CMD 12 has plural sections, such as M sections (U1-UM), each of which is a CMD unit U that can perform a charge multiplication operation, set in series. Each section of CMD unit Ui has plural (such as 4) electrodes G1, G2, G3, G4 set in a row via an insulating film, such as silicon oxide film 100, on a silicon insulating film. Among driving voltages P1, P2, P3, P4 applied on the electrodes G1, G2, G3 and G4, P1 and P2 are applied in the same cycle as the transfer clock, P4 for impact ionization is applied in intermittent cycles with respect to P1 and P2, and P3 is applied as a DC voltage at a prescribed level.

Abstract: In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.

Abstract: A vehicle headrest apparatus has a headrest unit mounted to an upper end of a seatback. The headrest unit has a headrest members with a head restraining member configured to be tensioned to restrain a passenger's head upon a rear-end collision. The headrest unit quickly and reliably restrains a seated passenger's head during a rear-end collision without utilizing the inertia force of the passenger's body by detecting the rear-end collision and pushing the headrest unit only outward in the forward direction of the vehicle. The headrest unit also has a swing/pushup device that to pushes the headrest members upwardly and forwardly. An auxiliary swing force adding device applies an auxiliary spring force in the deployment direction of the headrest members to increase the deployment speed of the headrest members and shorten the amount of time required to achieve initial contact between the passenger's head H and the head restraining member.

Abstract: A semiconductor device includes a resin housing provided with a functional part, a wire pattern made of a conductive material and molded in the resin housing, a part of the wire pattern being exposed from the resin housing, an electronic part connected with the wire pattern in a state where the electronic parts is molded in the resin housing, and a semiconductor element connected to the part of the wire pattern being exposed from the resin housing. The semiconductor element provides a designated function in cooperation with a functional part of the resin housing.