Abstract: A polishing device has a reel core around which a polishing tape is wound and a reel plate with flanges that engage with the polishing tape and sandwich it from both sides. A memory element with data on the polishing tape is provided to the reel core such that errors caused by using a wrong kind of polishing tape can be obviated.

Abstract: A polishing device has a reel core around which a polishing tape is wound and a reel plate with flanges that engage with the polishing tape and sandwich it from both sides. A memory element with data on the polishing tape is provided to the reel core such that errors caused by using a wrong kind of polishing tape can be obviated.

Abstract: A device for cleaning the tip portion and the side surfaces of a probe has two or more different kinds of intermediate sheets affixed to a substrate in a side-by-side relationship with respect to each other. One of these intermediate sheets is an elastic sheet having an elastic property. Another intermediate sheet of a different kind is a plastic sheet which is less elastic. The tip portion of a probe is cleaned by a polishing layer affixed to the elastic sheet. The side surfaces of the probe are cleaned by a polishing layer affixed to the plastic sheet. A porous foamed sheet having openings on its surface and having air bubbles inside may be used as the elastic sheet. A polishing layer is formed on the surface of the foamed sheet, having a porous surface with openings corresponding to the openings on the foamed sheet. A spacer may be provided between the substrate and the plastic sheet for adjusting the heights of the polishing layers formed over the intermediate sheets.

Abstract: A polishing head for polishing the end surface of a semiconductor wafer has a driver roller, a driving motor for rotating it, a pair of upper and lower follower rollers one above the other parallel to and horizontally separated from the driver roller and an endless polishing belt around these rollers. As the driving motor causes the polishing belt to run around the rollers, the semiconductor wafer is pushed against the polishing belt between the upper and lower follower rollers. A pair of upper and lower tension-controlling rollers are provided for controlling the tension in the polishing belt between the two follower rollers. At least one of these tension-controlling rollers is movable vertically. A polisher is formed with such a polishing head, a holder for holding and rotating the wafer and an attaching device for attaching the polishing head to the polisher.

Abstract: A device for cleaning the tip portion and the side surfaces of a probe has two or more different kinds of intermediate sheets affixed to a substrate in a side-by-side relationship with respect to each other. One of these intermediate sheets is an elastic sheet having an elastic property. Another intermediate sheet of a different kind is a plastic sheet which is less elastic. The tip portion of a probe is cleaned by a polishing layer affixed to the elastic sheet. The side surfaces of the probe are cleaned by a polishing layer affixed to the plastic sheet. A porous foamed sheet having openings on its surface and having air bubbles inside may be used as the elastic sheet. A polishing layer is formed on the surface of the foamed sheet, having a porous surface with openings corresponding to the openings on the foamed sheet. A spacer may be provided between the substrate and the plastic sheet for adjusting the heights of the polishing layers formed over the intermediate sheets.

Abstract: A polishing head for polishing the end surface of a semiconductor wafer has a driver roller, a driving motor for rotating it, a pair of upper and lower follower rollers one above the other parallel to and horizontally separated from the driver roller and an endless polishing belt around these rollers. As the driving motor causes the polishing belt to run around the rollers, the semiconductor wafer is pushed against the polishing belt between the upper and lower follower rollers. A pair of upper and lower tension-controlling rollers are provided for controlling the tension in the polishing belt between the two follower rollers. At least one of these tension-controlling rollers is movable vertically. A polisher is formed with such a polishing head, a holder for holding and rotating the wafer and an attaching device for attaching the polishing head to the polisher.

Abstract: A polishing apparatus has a spindle disposed rotatably through an opening of a base plate, a pair of side walls attached to the spindle, a compression roller attached rotatably to an end part of and between the side walls for compressing a polishing tape onto a target object, a tape-supplying roller and a take-up roller which are both attached rotatably between and to the side walls between the spindle and the compression roller, and a tape-running roller attached rotatably between and to the side walls for causing the polishing tape to travel. The axis of rotation of the compression roller intersects that of the spindle perpendicularly and both the tape-supplying and take-up rollers are parallel to the compression roller and their axes of rotation intersect that of the spindle such that the center of gravity of the apparatus is always on the axis of rotation of the spindle.

Abstract: A polishing apparatus, for polishing/cleaning a target object surface by using a polishing tape, has a spindle rotatably placed inside an opening formed in a base plate, a motor for rotating the spindle, a compression roller rotatably supported between a pair of side walls attached to the spindle, supply and take-up rollers supported rotatably by the side walls for advancing the polishing tape, and a motor for the take-up roller. The polishing tape is supplied from the supply roller and taken up by the take-up roller through the compression roller, while rotating around with the spindle. The compression roller has a smaller diameter at its center part than at its end parts for preventing the polishing tape from becoming twisted or wrinkled when the compression roller is rotated by the motion of the spindle while being pressed against a target object and being advanced from the supply roller to the take-up roller.

Abstract: An apparatus has a polishing head for polishing an object such as a semiconductor wafer by using a polishing tape stretched between two guide rollers. The head can be rotated so as to change the angle of contact between the tape and the object and also undergo a reciprocating motion perpendicular to the direction of supply of the tape. For this purpose, the apparatus includes a first plate attached to the head and a second plate supported parallel to each other and in motion-communicating relationship by means of rods which are attached to the first plate and penetrate the second plate. The second plate is attached to the rotary shaft of a direct drive motor for causing oscillatory angular motion. This rotary shaft is tubular and an inner shaft for causing the oscillatory motion passes slidably therethrough.