Patents by Inventor Izuru Nakai

Izuru Nakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11938561
    Abstract: A laser processing apparatus includes a light source configured to emit laser light; a power supply configured to supply a current to the light source; a deflection unit on an optical path of the laser light and including an optical element configured to change an amount of transmission of the laser light to deflect at least a part of the laser light; an optical separation unit on the optical path of the laser light and being configured to shield higher-order light included in the laser light and deflected by the optical element in the deflection unit, and transmit zero-order light that is included in the laser light and passes through the deflection unit; and a signal synchronization unit configured to control the power supply to selectively turn the current on or off in synchronization with a timing at which the higher-order light is deflected by the optical element.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: March 26, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Izuru Nakai, Takaaki Kassai, Takayuki Yoshida
  • Publication number: 20230390863
    Abstract: A determination method for determining a processing state includes detecting, using an optical sensor, at least one of heat radiation light, visible light, and reflected light generated at a welded portion formed at a surface of a workpiece by emission of a laser beam on the workpiece, obtaining a signal indicating a change in at least one of heat radiation light, visible light, and reflected light in a time section corresponding to a welding time of each workpiece, calculating a feature quantity including a gradient of a straight line approximating a signal waveform of the signal in a predetermined section in the time section, determining, as the processing state, a shift including farness and closeness of a focal position of the laser beam in an emission direction of the laser beam by inputting the calculated feature quantity to a determination model that determines the processing state.
    Type: Application
    Filed: August 16, 2023
    Publication date: December 7, 2023
    Inventors: Kazuki FUJIWARA, Koji FUNAMI, Izuru NAKAI
  • Publication number: 20230390871
    Abstract: An estimation model generation device is a device that generates an estimation model for estimating a processing state of laser processing. First thermal radiation, first visible light, first reflected light, and first laser light are observed from a workpiece during laser processing by a first device, and the device includes an information acquiring section that acquires first waveform data including a first waveform and a second waveform for at least two of the first thermal radiation, the first visible light, the first reflected light, and the first laser light, an estimation model generating section that performs machine learning by using teacher data having the first waveform data as an explanatory variable and the processing state as a target variable in association with each other to generate a first estimation model for estimating the processing state by the first device, and a storage that stores the first estimation model.
    Type: Application
    Filed: August 21, 2023
    Publication date: December 7, 2023
    Inventors: Izuru NAKAI, Kazuki FUJIWARA, Koji FUNAMI
  • Publication number: 20230384282
    Abstract: A determination method for determining a processing state includes detecting, using an optical sensor, at least one of heat radiation light, visible light, and reflected light generated at a welded portion formed at a surface of a workpiece by emission of a laser beam on the workpiece, obtaining, from the optical sensor, a signal indicating a change in one of heat radiation, visible light, and reflected light in a time section corresponding to a welding time of each workpiece, determining, as the processing state, the position and number of molten shape abnormality in a welded region having a molten length and a molten width by inputting a feature quantity to a determination model that determines the processing state, the feature quantity including signal intensity of the signal, the molten shape abnormality occurring when a foreign substance exists at an overlapping surface of the workpiece, and outputting a determination result.
    Type: Application
    Filed: August 15, 2023
    Publication date: November 30, 2023
    Inventors: Kazuki FUJIWARA, Koji FUNAMI, Izuru NAKAI
  • Publication number: 20220388098
    Abstract: A laser processing method for scanning over a first member in a first direction while irradiating the first member with a laser beam emitted from an oscillator, and joining the first member and a second member adjacent to the first member by a molten portion, the laser processing method including the steps of: in each of a first measurement region and a second measurement region different from the first measurement region, measuring an intensity of a welding light including any one of a heat radiation light radiated from at least one of the first member and the second member by irradiation with the laser beam, a plasma light, and a reflected light; and evaluating a processing state based on the intensity of the welding light measured in each of the first measurement region and the second measurement region, in which the first measurement region and the second measurement region are aligned in a second direction intersecting the first direction.
    Type: Application
    Filed: May 19, 2022
    Publication date: December 8, 2022
    Inventors: KOJI FUNAMI, KAZUKI FUJIWARA, IZURU NAKAI
  • Patent number: 11489239
    Abstract: A cylindrical battery includes an electrode unit configured as a roll of a first electrode plate and a second electrode plate with a separator in between. The first electrode plate is an electrode plate to which one end of a first electrode tab and one end of a second electrode tab are connected, and the second electrode plate has the opposite polarity from the first electrode plate. Additionally, a case houses the electrode unit and a sealing member seals an opening rim of the case. The first electrode tab and the second electrode tab are disposed to project out from the first electrode plate at opposite ends of a winding axis of the first electrode plate. The first electrode tab contacts at a bottom portion of the case and the second electrode tab is welded at the opening rim side opposite the bottom portion of the case.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: November 1, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Koji Funami, Izuru Nakai, Kazumichi Shimizu, Hiroshi Takasaki
  • Publication number: 20220326590
    Abstract: A laser shutter unit includes an acousto-optic element configured to switch an emission direction of incident laser light between a first direction and a second direction, and a multiple reflective optical element configured to reflect first light that is the laser light emitted from the acousto-optic element in the first direction and second light that is the laser light emitted from the acousto-optic element in the second direction, and further reflect at least one of the first light and the second light.
    Type: Application
    Filed: March 15, 2022
    Publication date: October 13, 2022
    Inventors: SHIGEYUKI MORI, IZURU NAKAI, TAKAYUKI YOSHIDA, TAKAAKI KASSAI
  • Publication number: 20220173576
    Abstract: Provided is a laser oscillation device including; a plurality of semiconductor laser diodes (1a to 1e); optical component (5) that directs a plurality of laser beams emitted from the plurality of semiconductor laser diodes in a specific direction to generate a superimposed laser beam including the plurality of laser beams and propagating in the specific direction; and optical switching element (130) that receives the superimposed laser beam from optical component (5). The superimposed laser beam has a plurality of wavelengths.
    Type: Application
    Filed: February 17, 2022
    Publication date: June 2, 2022
    Inventors: TAKAYUKI YOSHIDA, TAKAAKI KASSAI, IZURU NAKAI
  • Publication number: 20220143745
    Abstract: An evaluation method for evaluating laser machining in which irradiation region of a laser beam is moved relative to object to perform machining of object, includes a measurement step and an evaluation step. In the measurement step, a change in an intensity of light according to a movement of measurement region is measured by moving measurement region for measuring the intensity of light, relative to object. In the evaluation step, an evaluation of the laser machining is performed based on the change in the intensity of light according to the movement of measurement region. In the measurement step, measurement region is moved relative to object so that movement path of measurement region has a plurality of intersections with movement path of irradiation region.
    Type: Application
    Filed: October 5, 2021
    Publication date: May 12, 2022
    Inventors: KOJI FUNAMI, KAZUKI FUJIWARA, IZURU NAKAI
  • Patent number: 11233164
    Abstract: A solar cell (1) includes a semiconductor substrate (10) having a light-receiving surface (10a) and a back surface (10b); an n-type semiconductor layer (13n) and a p-type semiconductor layer (12p) provided on the back surface (10b) of the semiconductor substrate (10), the n-type semiconductor layer (13n) and the p-type semiconductor layer (12p) extending in a first direction and being adjacent to each other in a second direction intersecting with the first direction; and a ground layer (14) provided on the n-type semiconductor layer (13n) and the p-type semiconductor layer (12p). The ground layer (14) includes an n-side ground layer (14n) and a p-side ground layer (14p) separated from each other by a first separating groove (17) having a first separating portion (17a) and a second separating portion (17b) as well as a first bridge portion (18) separating the first separating portion (17a) and the second separating portion (17b).
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: January 25, 2022
    Assignee: PANASONIC CORPORATION
    Inventors: Daiji Kanematsu, Keiichiro Masuko, Izuru Nakai, Hirotaka Katayama
  • Publication number: 20210346984
    Abstract: A laser processing apparatus includes a light source including a laser oscillator that emits laser light; a power supply that supplies a current to the light source; a deflection unit that is provided on an optical path of the laser light emitted from the light source and includes an optical element that changes an amount of transmission of the laser light to deflect at least a part of the laser light; an optical separation unit that is provided on the optical path of the laser light passing through the deflection unit, shields higher-order light that is included in the laser light and deflected by the optical element in the deflection unit, and transmits zero-order light that is included in the laser light and passes through the deflection unit; and a signal synchronization unit that controls selectively turns on or off the current in synchronization with a timing at which the higher-order light is deflected by the optical element.
    Type: Application
    Filed: April 16, 2021
    Publication date: November 11, 2021
    Inventors: IZURU NAKAI, TAKAAKI KASSAI, TAKAYUKI YOSHIDA
  • Publication number: 20210159355
    Abstract: A solar cell (1) includes a semiconductor substrate (10) having a light-receiving surface (10a) and a back surface (10b); an n-type semiconductor layer (13n) and a p-type semiconductor layer (12p) provided on the back surface (10b) of the semiconductor substrate (10), the n-type semiconductor layer (13n) and the p-type semiconductor layer (12p) extending in a first direction and being adjacent to each other in a second direction intersecting with the first direction; and a ground layer (14) provided on the n-type semiconductor layer (13n) and the p-type semiconductor layer (12p). The ground layer (14) includes an n-side ground layer (14n) and a p-side ground layer (14p) separated from each other by a first separating groove (17) having a first separating portion (17a) and a second separating portion (17b) as well as a first bridge portion (18) separating the first separating portion (17a) and the second separating portion (17b).
    Type: Application
    Filed: January 9, 2019
    Publication date: May 27, 2021
    Inventors: Daiji KANEMATSU, Keiichiro MASUKO, Izuru NAKAI, Hirotaka KATAYAMA
  • Publication number: 20200176750
    Abstract: A cylindrical battery having improved strength against rotational torque includes: an electrode unit configured as a roll of a first electrode plate and a second electrode plate with a separator in between, the first electrode plate being an electrode plate to which one end of a first electrode tab and one end of a second electrode tab are connected, the second electrode plate having opposite polarity from the first electrode plate; a case housing the electrode unit; and a sealing member sealing an opening rim of the case. The first electrode tab and the second electrode tab are disposed to project out from the first electrode plate at opposite ends of a winding axis of the first electrode late. The first electrode tab is in contact with a bottom portion of the case by being welded thereto. The second electrode tab is welded at the opening rim side opposite the bottom portion of the case.
    Type: Application
    Filed: October 17, 2019
    Publication date: June 4, 2020
    Inventors: KOJI FUNAMI, IZURU NAKAI, KAZUMICHI SHIMIZU, HIROSHI TAKASAKI
  • Publication number: 20200098939
    Abstract: A method of manufacturing a solar cell includes: forming a metal layer on a semiconductor substrate; forming a resist layer on the metal layer, the resist layer including a resin and inorganic particles having a higher optical absorptance at a predetermined wavelength than the resin; forming an opening through which the metal layer is exposed, by irradiating the resist layer with a laser light having the predetermined wavelength and removing the resist layer; and wet etching the metal layer exposed in the opening.
    Type: Application
    Filed: September 4, 2019
    Publication date: March 26, 2020
    Inventors: Izuru NAKAI, Daiji KANEMATSU, Koichi HIRANO
  • Publication number: 20150260985
    Abstract: In a laser processing apparatus and a laser processing method, a laser beam radiated from a laser oscillator is positioned on one minute diffraction pattern or over two or more minute diffraction patterns provided in a diffraction optical element by a moving unit. A laser beam to which a desired beam profile is given is reflected at an angle in which the laser beam is radiated to a target position on a processed object by a scanning unit, and the laser beam is transmitted through the lens unit a position in the Z-axis direction of which is controlled so that a focal point of the lens unit corresponds to the surface of the processed object. The processed object is irradiated with a laser beam converged by the lens unit and having a desired laser beam profile to realize desired processing.
    Type: Application
    Filed: February 19, 2015
    Publication date: September 17, 2015
    Inventors: YOSHIRO KITAMURA, IZURU NAKAI
  • Patent number: 8525072
    Abstract: By irradiating laser light 20 obliquely onto a substrate 6, the laser soldering apparatus reduces the laser light passing through an insertion hole 61a in the substrate 6 and prevents damage to low-heat-resistance portions of a component 62 disposed on the rear surface side of the substrate 6. Moreover, the substrate 6 can be observed from a normal direction with a camera 23. Therefore, even if the insertion hole 61 for inserting a component lead or the like is provided in the substrate 6, the laser light does not leak out to the side of a component mounting surface 17 of the substrate 6.
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: September 3, 2013
    Assignee: Panasonic Corporation
    Inventors: Izuru Nakai, Masahiro Mori, Yukio Nishikawa
  • Patent number: 7897892
    Abstract: A light source (2) and a connection base (1) are held with a predetermined gap, solder paste melted by the thermal energy of laser light is fed into the gap, and the light source (2) and the connection base (1) are bonded together via a solder layer (32).
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: March 1, 2011
    Assignee: Panasonic Corporation
    Inventors: Masahiro Mori, Izuru Nakai, Toshiharu Kimura, Takeshi Fujishima
  • Publication number: 20100206854
    Abstract: By irradiating laser light 20 obliquely onto a substrate 6, the laser soldering apparatus reduces the laser light passing through an insertion hole 61a in the substrate 6 and prevents damage to low-heat-resistance portions of a component 62 disposed on the rear surface side of the substrate 6. Moreover, the substrate 6 can be observed from a normal direction with a camera 23. Therefore, even if the insertion hole 61 for inserting a component lead or the like is provided in the substrate 6, the laser light does not leak out to the side of a component mounting surface 17 of the substrate 6.
    Type: Application
    Filed: February 17, 2010
    Publication date: August 19, 2010
    Applicant: PANASONIC CORPORATION
    Inventors: Izuru Nakai, Masahiro Mori, Yukio Nishikawa
  • Patent number: 7440199
    Abstract: In an optical component where fixation of resin welding is performed by emitting a laser beam to screwing parts of an inner lens barrel and an outer lens barrel after focus adjustment, the laser beam is emitted to melt and cure a joint of the screwing part of the inner lens barrel and the screwing part of the outer lens barrel by 0.5 mm to 3.0 mm in a direction parallel to a direction of protrusion of the inner lens barrel relative to the outer lens barrel, so that welding and fixation are completed.
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: October 21, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Izuru Nakai, Seiji Kumazawa
  • Publication number: 20070095806
    Abstract: A light source (2) and a connection base (1) are held with a predetermined gap, solder paste melted by the thermal energy of laser light is fed into the gap, and the light source (2) and the connection base (1) are bonded together via a solder layer (32).
    Type: Application
    Filed: October 26, 2006
    Publication date: May 3, 2007
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masahiro Mori, Izuru Nakai, Toshiharu Kimura, Takeshi Fujishima