Abstract: Methods and systems for making a multi-layer circuit board are disclosed, including electrically connecting a boring device with a plated multi-layered circuit board; cutting a first bore having a first diameter through a first layer of the plated multi-layered circuit board; reciprocally extending a second cutting device a first predetermined distance into a barrel plated multi-layered circuit board and retracting the cutting device a second predetermined distance that is less than the first predetermined distance to form a second bore; after each retraction, sensing for electrical contact indicating a closed circuit between the cutting device and the plated multi-layered circuit board; if a closed circuit is sensed, determining if the second bore has reached an expected depth of a contact layer; and if the expected depth of the contact layer has not been reached, determining that a sliver has been formed in the barrel.

Abstract: Methods for producing a printed circuit board and printed circuit boards are disclosed, including a method in which a slot is formed in a substrate, the substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. The conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

Abstract: A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

Abstract: A hollow core element forming system including a measuring device configured to determine a location of a welding plate assembly on a casting bed. The welding plate assembly being connected to one or more prestressed strands. A hollow core forming mechanism has a strand guide located at a leading end of a support frame of the hollow core forming mechanism. The strand guide is configured to engage the one or more prestressed strands when the strand guide is in a closed position and to disengage the one or more prestressed strands when the strand guide is in an open position without interference between the strand guide and the welding plate assembly. A strand guide controller unit causes the strand guide to rotate between the open position and the closed position based on the location of the strand guide relative to the welding plate assembly.

Abstract: A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

Abstract: Methods and systems for making a multi-layer circuit board are disclosed, including electrically connecting a boring device with a plated multi-layered circuit board; cutting a first bore having a first diameter through a first layer of the plated multi-layered circuit board; reciprocally extending a second cutting device a first predetermined distance into a barrel plated multi-layered circuit board and retracting the cutting device a second predetermined distance that is less than the first predetermined distance to form a second bore; after each retraction, sensing for electrical contact indicating a closed circuit between the cutting device and the plated multi-layered circuit board; if a closed circuit is sensed, determining if the second bore has reached an expected depth of a contact layer; and if the expected depth of the contact layer has not been reached, determining that a sliver has been formed in the barrel.

Abstract: A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

Abstract: A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

Abstract: A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

Abstract: A method for producing a printed circuit board is disclosed. In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

Abstract: A method for producing a printed circuit board is disclosed. In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.