Patents by Inventor J. Andrew Yeh

J. Andrew Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070269914
    Abstract: An apparatus for aligning microelements on a substrate and a method for the same are provided. The steps of the method include providing a substrate, forming a protruding structure on the substrate, providing a microelement, forming a microdroplet on the protruding structure, and forcing the microelement to contact the microdroplet. The surface tension of the microdroplet is used to move the microdroplet to a surface of the protruding structure.
    Type: Application
    Filed: October 25, 2006
    Publication date: November 22, 2007
    Applicants: National Tsing-Hua University, Industrial Technology Research Institute
    Inventors: J. Andrew Yeh, Gary C-W Tsai, C. Max Hsieh, Weng Wen-Jey, Huang Yi-Ping, Kao Chi-Chun, Chou Ming-Hung
  • Patent number: 6543087
    Abstract: The micro-electromechanical hinged flap system includes a substantially horizontal substrate and a main flap hinged on one side thereof to the substrate. The system also includes at least one locking flap, preferably two, for securing the main flap in a substantially vertical position. The locking flap is coupled to the substrate by means of a biasing mechanism that continually forces the locking flap toward a position parallel to the substrate. Also provided is a method for assembling a micro-electromechanical hinged flap system. A locking flap is rotated through an acute angle against a biasing force. The biasing force is caused by a biasing mechanism coupling the locking flap to a substrate. A main flap is then raised, whereafter the locking flap is released, such that the biasing force causes the locking flap to engage with the main flap, thereby, securing the main flap in position at the predetermined angle.
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: April 8, 2003
    Assignee: AIP Networks, Inc.
    Inventors: J. Andrew Yeh, Tom A. Kwa, Robertus Petrus Van Kampen
  • Publication number: 20020180311
    Abstract: The micro-electromechanical hinged flap system includes a substantially horizontal substrate and a main flap hinged on one side thereof to the substrate. The system also includes at least one locking flap, preferably two, for securing the main flap in a substantially vertical position. The locking flap is coupled to the substrate by means of a biasing mechanism that continually forces the locking flap toward a position parallel to the substrate. Also provided is a method for assembling a micro-electromechanical hinged flap system. A locking flap is rotated through an acute angle against a biasing force. The biasing force is caused by a biasing mechanism coupling the locking flap to a substrate. A main flap is then raised, whereafter the locking flap is released, such that the biasing force causes the locking flap to engage with the main flap, thereby, securing the main flap in position at the predetermined angle.
    Type: Application
    Filed: June 1, 2001
    Publication date: December 5, 2002
    Inventors: J. Andrew Yeh, Tom A. Kwa, Robertus Petrus Van Kampen
  • Publication number: 20020154851
    Abstract: An optical modular switching system comprising a first optical switch module having at least one first optical input port, at least one first optical output port, and at least one first interconnect port. The optical modular switching system also comprises a second optical switch module having at least one second optical input port, at least one second optical output port, and at least one second interconnect port. Finally, the optical modular switching system comprises an optical interconnect that optically couples the first optical interconnect port to the second optical interconnect port. The invention also provides a method for switching an optical signal. Additional optical switch modules can be added to incrementally grow the optical modular switching system.
    Type: Application
    Filed: April 18, 2001
    Publication date: October 24, 2002
    Inventors: J. Andrew Yeh, Norman C. Tien, Weijie Yun, Chang-Lin Tien