Patents by Inventor J.B. Chyi

J.B. Chyi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive structure for a semiconductor integrated circuit and method for forming the same
    Publication number: 20080197467
    Abstract: A conductive structure for a semiconductor integrated circuit and method for forming the conductive structure are provided. The semiconductor integrated circuit has a pad and a passivation layer partially covering the pad to define a first opening portion having a first lateral size. The conductive structure electrically connects to the pad via the first opening portion. The conductive structure comprises a support layer defining a second opening portion. A conductor is formed in the second opening portion to serve as a bump having a planar top surface.
    Type: Application
    Filed: September 13, 2007
    Publication date: August 21, 2008
    Inventors: J.B. Chyi, Cheng Tang Huang