Abstract: An apparatus includes a thermal spreader configured to remove thermal energy from a device to be cooled. The thermal spreader includes a ringframe having an opening, where the opening is configured to provide access to the device through the ringframe. The thermal spreader also includes a pair of thermal straps configured to fit within the opening. The pair of thermal straps is configured to be bonded to the device and to be fastened to the ringframe in order to provide the thermal energy from the device to the ringframe.

Abstract: A circuit card assembly including a printed circuit board arranged to include one or more electronic circuits and a frame connected to the printed circuit board. The circuit card including at least one connector arranged to detachably engage with a backplane connector of the electronic chassis to establish an electrical connection with a backplane printed wiring board (PWB) of the electronic chassis. The circuit card also including a front panel having at least one input/output connector and an EMI/RFI gasket positioned along a perimeter of the back side of the front panel where the EMI/RFI gasket is arranged to contact a surface of the electronic chassis along a perimeter of the circuit card assembly slot when the circuit card assembly is extended into the circuit card assembly slot.

Abstract: A circuit card assembly including a printed circuit board arranged to include one or more electronic circuits and a frame connected to the printed circuit board. The circuit card including at least one connector arranged to detachably engage with a backplane connector of the electronic chassis to establish an electrical connection with a backplane printed wiring board (PWB) of the electronic chassis. The circuit card also including a front panel having at least one input/output connector and an EMI/RFI gasket positioned along a perimeter of the back side of the front panel where the EMI/RFI gasket is arranged to contact a surface of the electronic chassis along a perimeter of the circuit card assembly slot when the circuit card assembly is extended into the circuit card assembly slot.

Abstract: An IMS DEDB database restructure operation creates an empty offline DEDB having the desired structure. The offline database is populated with data from a source (online) database while keeping the source database online (i.e., available for access and update operations). Updates to the source database made during this process are selectively processed in parallel with the offline DEDB load operation. When the contents of the offline database is substantially the same as the source or online database, the source database is taken offline, final updates to the offline database are applied whereafter the offline database is brought online, thereby replacing the source database. It is significant to note that updates occurring to the source or online DEDB are applied to the offline DEDB.

Abstract: An IMS DEDB database restructure operation creates an empty offline DEDB having the desired structure. The offline database is populated with data from a source (online) database while keeping the source database online (i.e., available for access and update operations). Updates to the source database made during this process are selectively processed in parallel with the offline DEDB load operation. When the contents of the offline database is substantially the same as the source or online database, the source database is taken offline, final updates to the offline database are applied whereafter the offline database is brought online, thereby replacing the source database. It is significant to note that updates occurring to the source or online DEDB are applied to the offline DEDB.

Abstract: An IMS DEDB database restructure operation creates an empty offline DEDB having the desired structure. The offline database is populated with data from a source (online) database while keeping the source database online (i.e., available for access and update operations). Updates to the source database made during this process are selectively processed in parallel with the offline DEDB load operation. When the contents of the offline database is substantially the same as the source or online database, the source database is taken offline, final updates to the offline database are applied whereafter the offline database is brought online, thereby replacing the source database. It is significant to note that updates occurring to the source or online DEDB are applied to the offline DEDB.

Abstract: This invention relates to NPC-1 antigen on the MUC5AC protein and 16C3 antigen on CEACAM5 and CEACAM6 proteins, and 31.1 epitope on the A33 protein are differentially expressed in cancers including, lung cancer, ovarian cancer, pancreas cancer, breast cancer, and colon cancer, and diagnostic and therapeutic usages. Further, NPC-1, 16C3, and/or 31.1 epitope specific antibodies and diagnostic and therapeutic methods of use.

Abstract: An IMS DEDB database restructure operation creates an empty offline DEDB having the desired structure. The offline database is populated with data from a source (online) database while keeping the source database online (i.e., available for access and update operations). Updates to the source database made during this process are selectively processed in parallel with the offline DEDB load operation. When the contents of the offline database is substantially the same as the source or online database, the source database is taken offline, final updates to the offline database are applied whereafter the offline database is brought online, thereby replacing the source database. It is significant to note that updates occurring to the source or online DEDB are applied to the offline DEDB.

Abstract: The present invention provides for purified or highly pure recombinant monoclonal antibodies that bind to human colorectal and pancreatic carcinoma-associated antigens (CPAA), along with nucleic acid sequences encoding the antibody chains, and the amino acid sequences corresponding to said nucleic acids and uses for said sequences.

Abstract: A fiber-optic device package structure includes at least one, and typically several, optical stage subassemblies, and a housing in which each optical stage subassembly is received in a parallel, facing arrangement. Each optical stage subassembly has a thermnal/structural plate, an annular plurality of turns of a fiber-optic fiber supported on the thermal/structural plate, and a light connector to the fiber-optic fiber. Preferably, the annular plurality of turns is formed as a freestanding annulus of the plurality of turns of the fiber-optic fiber encapsulated within an encapsulant.

Abstract: An optical transition device provides a connection between two fiber structures. The device comprises a first transition body having a first transition body bore therethrough, a first fiber connector connected to the first transition body and having a first connector bore therethrough, a second transition body affixed to the first transition body and having a second transition body bore therethrough, and a second fiber connector connected to the second transition body and having a second connector bore therethrough. The first connector bore, the first transition body bore, the second transition body bore, and the second connector bore are coaxial along a transition axis. A graded-index lens is disposed within the transition body bores with an optical axis of the lens coincident with the transition axis. An axial positioning structure positions the graded-index lens axially along the transition axis.