Patents by Inventor J. C. Chiou

J. C. Chiou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a plug
    Patent number: 6221754
    Abstract: A method of fabricating a plug etches back the first plug material layer to form a dished surface on the first plug material layer and then performs a second coverage step. A second plug material layer is formed to fill the dished surface and a hole. Thus, the slurry cannot fill the hole during chemical mechanical polishing nor can slurry react with the plug material or the first metallic layer. The reliability of the plug according to the present invention is increased. The thickness of the second plug material layer is thinner than the plug material layer of the conventional method. The thickness is decreased by about 60% when compared with the conventional method, which decreases fabrication costs.
    Type: Grant
    Filed: October 28, 1998
    Date of Patent: April 24, 2001
    Assignee: United Microelectronics Corp.
    Inventors: J. C. Chiou, Hsiao-Pang Chou