Patents by Inventor J. C. Deng

J. C. Deng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive for connecting a circuit member to a substrate
    Patent number: 5453148
    Abstract: An uniaxial adhesive for connecting a circuit member having a plurality of laterally spaced conductive terminals to a substrate including a mounting space having a plurality of laterally spaced conductive paths contains at least 10 percent by weight of compressible hollow conductive particles and a nonconductive polymeric resin. Magnetic field and pressure are applied to the adhesive to gather, concentrate and deform the hollow conductive particles between the conductive terminals and the conductive paths so as to assure excellent electrical connections therebetween.
    Type: Grant
    Filed: October 5, 1993
    Date of Patent: September 26, 1995
    Assignees: Industrial Technology Research Institute, United Microelectronics Corp.
    Inventors: Neng-Hsing Lu, Ning Yang, J. C. Deng, Dick Liao