Patents by Inventor J. C. Mataybas

J. C. Mataybas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080160177
    Abstract: Methods for forming traces/lines and interconnects on substrates and devices and systems thereof of herein disclosed. In some embodiments, an activator layer is deposited on a surface of a substrate. Pick-up lithography using a pre-patterned lithographic stamp, ultraviolet lithography or like methods are used to selectively remove portions of the activator layer to form a pattern on the surface of the substrate. Electroless metal deposition is then applied to the surface of the substrate to form a metal pattern selectively on the remaining activator layer. Electroless plating can then be used to form traces/lines and interconnects in dimensions of less than 10 micrometers.
    Type: Application
    Filed: December 29, 2006
    Publication date: July 3, 2008
    Inventors: J. C. Mataybas, Lakshmi Supriya, Omar Bchir