Patents by Inventor J. C. Tzeng

J. C. Tzeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Buried interconnect for silicon on insulator structure
    Patent number: 4778775
    Abstract: Improved processing for forming an interconnect in a process where a recrystallized polysilicon layer is formed over an insulative layer and where recrystallization takes place through a plurality of seed windows formed in the insulative layer. A doped region is formed in the substrate prior to deposition of the polysilicon layer. The polysilicon layer is in contact with at least a portion of the doped region through an opening in the insulative layer. Recrystallization takes place through this opening, and, for instance, the doped region is electrically connected to a source or drain region of a semiconductor device formed in the recrystallized layer.
    Type: Grant
    Filed: May 27, 1987
    Date of Patent: October 18, 1988
    Assignee: Intel Corporation
    Inventor: J. C. Tzeng
  • Process for forming MOS transistor with buried oxide regions for insulation
    Patent number: 4700454
    Abstract: MOS process for forming field-effect devices in self-alignment with a buried oxide region. Oxygen is implanted in alignment with masking members after gates have been defined from the masking members. The masking members block the oxygen implantation and thus the channel regions of subsequently formed transistors are self-aligned with openings in the buried oxide layer.
    Type: Grant
    Filed: November 4, 1985
    Date of Patent: October 20, 1987
    Assignee: Intel Corporation
    Inventors: William Baerg, Chiu H. Ting, Byron B. Siu, J. C. Tzeng
  • Device and method for three point electro therapy
    Patent number: 4106513
    Abstract: A device and method for use in the treatment of arthritic symptoms in joints, for example finger and wrist joints, whereby a pulsating, low voltage, direct current electricity is applied to the skin surface at three points, causing electricity to flow through the joint for the elimination of stiffness, soreness, discomfort and the like. The apparatus provides the electricity at pulsating rates through and about the joint. Convenient elastic rings may be used to secure surface electrodes to the skin at the joint.BACKGROUND OF THE INVENTION1. Field of the InventionThis invention pertains to a healing and soothing device for use on a human or animal body to eliminate pain and discomfort at various points including arthritis, bursitis, neuralgia, rheumatism and the like in certain joints of the body.2. Description of the Prior ArtPrior art to which this invention pertains is generally known by the term acupuncture which has been practiced by the Chinese for many thousand years.
    Type: Grant
    Filed: February 17, 1976
    Date of Patent: August 15, 1978
    Inventor: J. C. Tzeng