Patents by Inventor J. Christopher Matayabas, Jr.

J. Christopher Matayabas, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold
    Patent number: 7332797
    Abstract: The specification discloses an apparatus comprising a die mounted on a substrate, the die being connected to the substrate by a plurality of wires, and a mold cap encapsulating the die and the plurality of wires, the mold cap comprising an electrically insulating portion encapsulating the wires and at least a portion of the die and a thermally conductive portion overmolded on the die and the electrically insulating portion. Also disclosed is a process comprising providing a die connected to a substrate by a plurality of wires, encapsulating the wires and at least a portion of the die in an electrically insulating material, and encapsulating the die, the wires and the electrically insulating material in a thermally conductive material. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: February 19, 2008
    Assignee: Intel Corporation
    Inventors: J. Christopher Matayabas, Jr., Constance L. Gettinger
  • Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold
    Patent number: 7141454
    Abstract: The specification discloses an apparatus comprising a die mounted on a substrate, the die being connected to the substrate by a plurality of wires, and a mold cap encapsulating the die and the plurality of wires, the mold cap comprising an electrically insulating portion encapsulating the wires and at least a portion of the die and a thermally conductive portion overmolded on the die and the electrically insulating portion. Also disclosed is a process comprising providing a die connected to a substrate by a plurality of wires, encapsulating the wires and at least a portion of the die in an electrically insulating material, and encapsulating the die, the wires and the electrically insulating material in a thermally conductive material. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: November 28, 2006
    Assignee: Intel Corporation
    Inventors: J. Christopher Matayabas, Jr., Constance L. Gettinger