Abstract: The disclosure concerns an electrolyte, an electrolyte ink, a battery or other electrochemical cell including the same, and methods of making the electrolyte and electrochemical cell. The electrolyte includes an ionic liquid comprising a hydrophilic or hydrophobic anion, a multi-valent metal cation suitable for use in a battery cell, a polymer binder, and optional additives (e.g., a solid filler). The electrolyte ink includes components of the electrolyte and a solvent. The solvent and the polymer binder (or, when present, the solid filler) have a hydrophilicity, hydrophobicity or polarity similar to or matching that of the ionic liquid's anion, or form hydrogen bonds with the ionic liquid's anion. The electrolyte includes a solid inorganic filler that provides mechanical support form hydrogen bonds with the anion and/or a counterpart anion of the multi-valent metal cation, and links with a material in an adjacent layer of the electrochemical cell.

Abstract: The disclosure concerns an electrolyte, an electrolyte ink, a battery or other electrochemical cell including the same, and methods of making the electrolyte and electrochemical cell. The electrolyte includes an ionic liquid comprising a hydrophilic or hydrophobic anion, a multi-valent metal cation suitable for use in a battery cell, a polymer binder, and optional additives (e.g., a solid filler). The electrolyte ink includes components of the electrolyte and a solvent. The solvent and the polymer binder (or, when present, the solid filler) have a hydrophilicity, hydrophobicity or polarity similar to or matching that of the ionic liquid's anion, or form hydrogen bonds with the ionic liquid's anion. The electrolyte includes a solid inorganic filler that provides mechanical support form hydrogen bonds with the anion and/or a counterpart anion of the multi-valent metal cation, and links with a material in an adjacent layer of the electrochemical cell.

Abstract: The disclosure concerns an electrolyte, an electrolyte ink, a battery or other electrochemical cell including the same, and methods of making the electrolyte and electrochemical cell. The electrolyte includes an ionic liquid comprising a hydrophilic or hydrophobic anion, a multi-valent metal cation suitable for use in a battery cell, a polymer binder, and optional additives (e.g., a solid filler). The electrolyte ink includes components of the electrolyte and a solvent. The solvent and the polymer binder (or, when present, the solid filler) have a hydrophilicity, hydrophobicity or polarity similar to or matching that of the ionic liquid's anion, or form hydrogen bonds with the ionic liquid's anion. The electrolyte includes a solid inorganic filler that provides mechanical support form hydrogen bonds with the anion and/or a counterpart anion of the multi-valent metal cation, and links with a material in an adjacent layer of the electrochemical cell.

Abstract: The disclosure concerns an electrochemical cell including a cathode, an electrolyte, and an anode including an elemental metal or metal alloy. The electrolyte includes an electrolyte salt, an ionic liquid, and an optional first polymer binder. The electrolyte and/or the anode further includes a protective metal salt in an amount sufficient to (i) reduce or eliminate hydrogen evolution or open circuit side reactions in the electrochemical cell, or (ii) plate out onto or alloy with the anode metal or conductive additives in the anode. The electrochemical cell may further include a first current collector in contact with the cathode, and a second current collector in contact with the anode. The second current collector may include a metal or metal alloy. In such cells, the second current collector may further include the protective metal salt, and the protective metal salt may plate out onto or alloy with the metal or metal alloy of the second current collector.

Abstract: A MOS RF surveillance and/or identification tag, and methods for its manufacture and use. The tag generally includes an interposer, an antenna and/or inductor on the interposer, and integrated circuitry on the interposer in a location other than the antenna and/or inductor. The integrated circuitry generally has a lowest layer in physical contact with the interposer surface. The method of manufacture generally includes forming a lowest layer of integrated circuitry on an interposer, forming successive layers of the integrated circuitry on the lowest layer of integrated circuitry, and attaching an electrically conductive functional layer to the interposer. Alternatively, an electrically conductive structure may be formed from a functional layer attached to the interposer.

Abstract: The disclosure concerns an electrolyte, an electrolyte ink, a battery or other electrochemical cell including the same, and methods of making the electrolyte and electrochemical cell. The electrolyte includes an ionic liquid comprising a hydrophilic or hydrophobic anion, a multi-valent metal cation suitable for use in a battery cell, a polymer binder, and optional additives (e.g., a solid filler). The electrolyte ink includes components of the electrolyte and a solvent. The solvent and the polymer binder (or, when present, the solid filler) have a hydrophilicity, hydrophobicity or polarity similar to or matching that of the ionic liquid's anion, or form hydrogen bonds with the ionic liquid's anion. The electrolyte includes a solid inorganic filler that provides mechanical support form hydrogen bonds with the anion and/or a counterpart anion of the multi-valent metal cation, and links with a material in an adjacent layer of the electrochemical cell.

Abstract: Methods, algorithms, processes, circuits, and/or structures for laser patterning suitable for customized RFID designs are disclosed. In one embodiment, a method of laser patterning of an identification device can include the steps of: (i) depositing a patternable resist formulation on a substrate having configurable elements and/or materials thereon; (ii) irradiating the resist formulation with a laser tool sufficiently to change the solubility characteristics of the resist in a developer; and (iii) developing exposed areas of the resist using the developer. Embodiments of the present invention can advantageously provide a relatively low cost and high throughput approach for customized RFID devices.

Abstract: Radio frequency identification (RFID) tags and processes for manufacturing the same. The RFID device generally includes (1) a metal antenna and/or inductor; (2) a dielectric layer thereon, to support and insulate integrated circuitry from the metal antenna and/or inductor; (3) a plurality of diodes and a plurality of transistors on the dielectric layer, the diodes having at least one layer in common with the transistors; and (4) a plurality of capacitors in electrical communication with the metal antenna and/or inductor and at least some of the diodes, the plurality of capacitors having at least one layer in common with the plurality of diodes and/or with contacts to the diodes and transistors. The method preferably integrates liquid silicon-containing ink deposition into a cost effective, integrated manufacturing process for the manufacture of RFID circuits. Furthermore, the present RFID tags generally provide higher performance (e.g.

Abstract: Radio frequency identification (RFID) tags and processes for manufacturing the same. The RFID device generally includes (1) a metal antenna and/or inductor; (2) a dielectric layer thereon, to support and insulate integrated circuitry from the metal antenna and/or inductor; (3) a plurality of diodes and a plurality of transistors on the dielectric layer, the diodes having at least one layer in common with the transistors; and (4) a plurality of capacitors in electrical communication with the metal antenna and/or inductor and at least some of the diodes, the plurality of capacitors having at least one layer in common with the plurality of diodes and/or with contacts to the diodes and transistors. The method preferably integrates liquid silicon-containing ink deposition into a cost effective, integrated manufacturing process for the manufacture of RFID circuits. Furthermore, the present RFID tags generally provide higher performance (e.g.

Abstract: A RF MOS- or nonlinear device-based surveillance identification tag, and methods for its manufacture and use. The tag includes an inductor, a capacitor plate coupled to the inductor, a dielectric film on the capacitor plate, a semiconductor component on the dielectric film, and a conductor providing electrical communication between the semiconductor component and the inductor. The method of manufacture includes depositing a semiconductor material/precursor on a dielectric film; forming a semiconductor component from the semiconductor material/precursor; forming a conductive structure at least partly on the semiconductor component; and etching the electrically functional substrate to form an inductor and/or a second capacitor plate. The method of use includes causing/inducing a current in the tag sufficient to generate detectable electromagnetic radiation; detecting the radiation; and selectively deactivating the tag.

Abstract: A MOS RF surveillance and/or identification tag, and methods for its manufacture and use. The tag includes an interposer, an antenna/inductor, and integrated circuitry on the interposer. The integrated circuitry has a lowest layer in physical contact with the interposer. The method of manufacture includes forming a lowest layer of integrated circuitry on an interposer, forming successive layers of the integrated circuitry on the lowest layer of integrated circuitry, and attaching an electrically conductive functional layer to the interposer. Alternatively, an electrically conductive structure may be formed from a functional layer attached to the interposer. The method of use includes causing/inducing a current in the present tag sufficient for it to generate, reflect or modulate a detectable electromagnetic signal, detecting the signal, and optionally, processing information conveyed by the detectable electromagnetic signal.

Abstract: Methods, algorithms, processes, circuits, and/or structures for laser patterning suitable for customized RFID designs are disclosed. In one embodiment, a method of laser patterning of an identification device can include the steps of: (i) depositing a patternable resist formulation on a substrate having configurable elements and/or materials thereon; (ii) irradiating the resist formulation with a laser tool sufficiently to change the solubility characteristics of the resist in a developer; and (iii) developing exposed areas of the resist using the developer. Embodiments of the present invention can advantageously provide a relatively low cost and high throughput approach for customized RFID devices.

Abstract: A light-emissive device comprising a light-emissive material provided between first and second electrodes such that charge carriers can move between the first and second electrodes and the light-emissive material, wherein the device includes a layer of a polymer blend provided between the first and second electrodes, phase separation of the polymers in the polymer blend having been induced in at least a portion of the polymer blend so as to control the propagation of light emitted by the light-emissive material in a predetermined direction.

Abstract: A MOS transistor with a laser-patterned metal gate, and methods for its manufacture. The method generally includes forming a layer of metal-containing material on a dielectric film, wherein the dielectric film is on an electrically functional substrate comprising an inorganic semiconductor; laser patterning a metal gate from the metal-containing material layer; and forming source and drain terminals in the inorganic semiconductor in locations adjacent to the metal gate. The transistor generally includes an electrically functional substrate; a dielectric film on at least portions of the electrically functional substrate; a laser patterned metal gate on the dielectric film; and source and drain terminals comprising a doped inorganic semiconductor layer adjacent to the metal gate. The present invention advantageously provides MOS thin film transistors having reliable electrical characteristics quickly, efficiently, and/or at a low cost by eliminating one or more conventional photolithographic steps.

Abstract: A MOS RF surveillance and/or identification tag, and methods for its manufacture and use. The tag includes an interposer, an antenna/inductor, and integrated circuitry on the interposer. The integrated circuitry has a lowest layer in physical contact with the interposer. The method of manufacture includes forming a lowest layer of integrated circuitry on an interposer, forming successive layers of the integrated circuitry on the lowest layer of integrated circuitry, and attaching an electrically conductive functional layer to the interposer. Alternatively, an electrically conductive structure may be formed from a functional layer attached to the interposer. The method of use includes causing/inducing a current in the present tag sufficient for it to generate, reflect or modulate a detectable electromagnetic signal, detecting the signal, and optionally, processing information conveyed by the detectable electromagnetic signal.

Abstract: A RF MOS- or nonlinear device-based surveillance and/or identification tag, and methods for its manufacture and use. The tag generally includes (a) an inductor, (b) a first capacitor plate coupled to the inductor, (c) a dielectric film on the first capacitor plate, (d) a semiconductor component on the dielectric film, and (e) a conductor that provides electrical communication between the semiconductor component and the inductor. The method of manufacture generally includes (1) depositing a semiconductor material (or precursor) on a dielectric film; (2) forming a semiconductor component from the semiconductor material/precursor; (3) forming a conductive structure at least partly on the semiconductor component; and (4) etching the electrically functional substrate to form (i) an inductor and/or (ii) a second capacitor plate.

Abstract: A light-emissive device comprising a light-emissive material provided between first and second electrodes such that charge carriers can move between the first and second electrodes and the light-emissive material, wherein the device includes a layer of a polymer blend provided between the first and second electrodes, phase separation of the polymers in the polymer blend having been induced in at least a portion of the polymer blend so as to control the propagation of light emitted by the light-emissive material in a predetermined direction.

Abstract: A light-emissive device comprising a light-emissive material provided between first and second electrodes such that charge carriers can move between the first and second electrodes and the light-emissive material, wherein the device includes a layer of a polymer blend provided between the first and second electrodes, phase separation of the polymers in the polymer blend having been induced in at least a portion of the polymer blend so as to control the propagation of light emitted by the light-emissive material in a predetermined direction.

Abstract: Radio frequency identification (RFID) tags and processes for manufacturing the same. The RFID device generally includes (1) a metal antenna and/or inductor; (2) a dielectric layer thereon, to support and insulate integrated circuitry from the metal antenna and/or inductor; (3) a plurality of diodes and a plurality of transistors on the dielectric layer, the diodes having at least one layer in common with the transistors; and (4) a plurality of capacitors in electrical communication with the metal antenna and/or inductor and at least some of the diodes, the plurality of capacitors having at least one layer in common with the plurality of diodes and/or with contacts to the diodes and transistors. The method preferably integrates liquid silicon-containing ink deposition into a cost effective, integrated manufacturing process for the manufacture of RFID circuits. Furthermore, the present RFID tags generally provide higher performance (e.g.

Abstract: Radio frequency identification (RFID) tags and processes for manufacturing the same. The RFID device generally includes (1) a metal antenna and/or inductor; (2) a dielectric layer thereon, to support and insulate integrated circuitry from the metal antenna and/or inductor; (3) a plurality of diodes and a plurality of transistors on the dielectric layer, the diodes having at least one layer in common with the transistors; and (4) a plurality of capacitors in electrical communication with the metal antenna and/or inductor and at least some of the diodes, the plurality of capacitors having at least one layer in common with the plurality of diodes and/or with contacts to the diodes and transistors. The method preferably integrates liquid silicon-containing ink deposition into a cost effective, integrated manufacturing process for the manufacture of RFID circuits. Furthermore, the present RFID tags generally provide higher performance (e.g.