Abstract: The preferred embodiments described herein relate to a redundant memory structure using bad bit pointers. In one preferred embodiment, data is written in a first plurality of memory cells, and an error is detected in writing data in one of the memory cells. In response to the detected error, a pointer is written in a second plurality of memory cells, the pointer identifying which memory cell in the first plurality of memory cells contains the error. During a read operation, the data is read from the first plurality of memory cells, and the pointer is read from the second plurality of memory cells. From the pointer, the memory cell containing the error is identified, and the error is corrected. Other preferred embodiments are provided, and each of the preferred embodiments can be used alone or in combination with one another.

Abstract: In one embodiment, a modular memory device is presented comprising a substrate, a memory array fabricated above the substrate, and first and second circuitry fabricated on the substrate and under the memory array. The first and second circuitry allow the modular memory device to interface with first and second varieties of host devices, respectively. In another embodiment, a modular memory device is presented comprising a substrate, a memory array fabricated above the substrate, memory array support circuitry fabricated on the substrate, and logic circuitry fabricated on the substrate and under the memory array.

Abstract: The preferred embodiments described herein relate to a redundant memory structure using bad bit pointers. In one preferred embodiment, data is written in a first plurality of memory cells, and an error is detected in writing data in one of the memory cells. In response to the detected error, a pointer is written in a second plurality of memory cells, the pointer identifying which memory cell in the first plurality of memory cells contains the error. During a read operation, the data is read from the first plurality of memory cells, and the pointer is read from the second plurality of memory cells. From the pointer, the memory cell containing the error is identified, and the error is corrected. Other preferred embodiments are provided, and each of the preferred embodiments can be used alone or in combination with one another.

Abstract: The preferred embodiments described herein relate to a redundant memory structure using bad bit pointers. In one preferred embodiment, data is written in a first plurality of memory cells, and an error is detected in writing data in one of the memory cells. In response to the detected error, a pointer is written in a second plurality of memory cells, the pointer identifying which memory cell in the first plurality of memory cells contains the error. During a read operation, the data is read from the first plurality of memory cells, and the pointer is read from the second plurality of memory cells. From the pointer, the memory cell containing the error is identified, and the error is corrected. Other preferred embodiments are provided, and each of the preferred embodiments can be used alone or in combination with one another.

Abstract: Support circuitry for a three-dimensional memory array is formed in a substrate at least partially under the three-dimensional memory array and defines open area in the substrate under the three-dimensional memory array. In one preferred embodiment, one or more memory arrays are formed at least partially in the open area under the three-dimensional memory array, while in another preferred embodiment, logic circuitry implementing one or more functions is formed at least partially in the open area under the three-dimensional memory array. In yet another preferred embodiment, both one or more memory arrays and logic circuitry are formed at least partially in the open area under the three-dimensional memory array. Other preferred embodiments are provided, and each of the preferred embodiments can be used alone or in combination with one another.

Abstract: A digital storage system is coupled to a write-once memory array. File delete commands are implemented by over-writing a destructive digital pattern to at least a portion of the memory cells associated with the file to be deleted. One disclosed system alters the manner in which a file delete command is implemented, depending upon whether the file is stored in a write-once memory or in a re-writable memory.

Abstract: The preferred embodiments described herein provide a three-dimensional memory cache system. In one preferred embodiment, a modular memory device removably connectable to a host device is provided. The modular memory device comprises a substrate, a cache memory array, a three-dimensional primary memory array, and a modular housing. The cache memory array and the three-dimensional primary memory array can be on the same or separate substrates in the modular housing. In another preferred embodiment, an integrated circuit is provided comprising a substrate, a cache memory array in the substrate, and a three-dimensional primary memory array above the substrate. Other preferred embodiments are provided, and each of the preferred embodiments can be used alone or in combination with one another.

Abstract: A digital storage system is coupled to a write-once memory array. File delete commands are implemented by over-writing a destructive digital pattern to at least a portion of the memory cells associated with the file to be deleted. One disclosed system alters the manner in which a file delete command is implemented, depending upon whether the file is stored in a write-once memory or in a re-writable memory.

Abstract: In one embodiment, a modular memory device is presented comprising a substrate, a memory array fabricated above the substrate, and first and second circuitry fabricated on the substrate and under the memory array. The first and second circuitry allow the modular memory device to interface with first and second varieties of host devices, respectively. In another embodiment, a modular memory device is presented comprising a substrate, a memory array fabricated above the substrate, memory array support circuitry fabricated on the substrate, and logic circuitry fabricated on the substrate and under the memory array.

Abstract: The preferred embodiments described herein provide a write-many memory device and method for limiting a number of writes to the write-many memory device. In one preferred embodiment, a write-many memory device is provided comprising a plurality of blocks of memory, each block being limited to N number of writes. Data can be stored in a block of memory only if there has been fewer than N number of writes to the block. In another preferred embodiment, a write-many memory device is provided comprising a plurality of blocks of memory, wherein each block comprises a first sideband field storing data indicating whether the block is free and a second sideband field storing data indicating how many times the block has been written into. The first and second sideband fields are used in a method for limiting a number of writes to the write-many memory device. Other preferred embodiments are provided, and each of the preferred embodiments can be used alone or in combination with one another.

Abstract: A modular memory device includes a support element, a memory unit comprising a three-dimensional memory array carried by the support element, a device interface unit carried by the support element and coupled with the memory unit, and an electrical connector carried by the support element and coupled with the device interface unit. The memory array is well suited for use as a digital medium storage device for digital media such as digital text, digital music, digital image or images, and digital video. The device interface unit is not required in all cases.

Abstract: The preferred embodiments described herein provide a three-dimensional memory cache system. In one preferred embodiment, a modular memory device removably connectable to a host device is provided. The modular memory device comprises a substrate, a cache memory array, a three-dimensional primary memory array, and a modular housing. The cache memory array and the three-dimensional primary memory array can be on the same or separate substrates in the modular housing. In another preferred embodiment, an integrated circuit is provided comprising a substrate, a cache memory array in the substrate, and a three-dimensional primary memory array above the substrate. Other preferred embodiments are provided, and each of the preferred embodiments can be used alone or in combination with one another.

Abstract: The preferred embodiments described herein relate to a monolithic integrated circuit comprising a three-dimensional memory array having a plurality of layers of memory cells stacked vertically above one another and above the substrate of the integrated circuit. Support circuitry for the three-dimensional memory array is formed in the substrate at least partially under the three-dimensional memory array and defines open area in the substrate under the three-dimensional memory array. In one preferred embodiment, one or more memory arrays are formed at least partially in the open area under the three-dimensional memory array, while in another preferred embodiment, logic circuitry implementing one or more functions is formed at least partially in the open area under the three-dimensional memory array. In yet another preferred embodiment, both one or more memory arrays and logic circuitry are formed at least partially in the open area under the three-dimensional memory array.

Abstract: A write-once memory device includes a memory array controller and an electronically resetable flag. The memory array controller prevents writing and erasing from a write-once memory array unless the flag is in a selected state. The memory device is used with a data storage system that automatically determines whether a memory device installed in the data storage system is a write-once memory, and then automatically sends a recognition signal to the memory device once it has been determined to be a write-once memory. The memory device (1) automatically sets the flag in response to the recognition signal, (2) automatically refuses to implement write and erase commands prior to receipt of the recognition signal and setting of the flag, and (3) implements write and erase commands subsequent to receipt of the recognition signal and setting of the flag. The memory device implements nondestructive commands such as read and status commands regardless of the state of the flag.