Abstract: A vertically integrated circuit assembly may include a substrate including a plurality of electrical traces, and a first circuit assembly layer disposed on the substrate. In embodiments, the first circuit assembly layer includes a first set of integrated circuit components, and a plurality of electrical interconnects configured to route signals through the first circuit assembly layer. In embodiments, the vertically integrated circuit assembly further includes a second circuit assembly layer coupled to the top surface of the first circuit assembly layer. The second circuit assembly layer may include a second set of integrated circuit components, and a plurality of electrical interconnects configured to route signals through the second circuit assembly layer. In embodiments, an electrical interconnect arrangement on a top surface of the first circuit assembly layer is configured to interface with an electrical interconnect arrangement on the bottom surface of the second circuit assembly layer.

Abstract: Apparatus and methods for insulating a connector that connects a first tubular member having a first flange with a second tubular member having a second flange. The apparatus comprises a generally tubular body forming a generally tubular cavity therein adapted to enclose the connector. The body has a longitudinal opening adapted to receive the first tubular member and a closure member for closing said opening. The body and the closure member are lined with insulation and include first and second seals for sealing with the first and second flanges so as to seal around the connector.

Abstract: An improved process for the preparation in high yields of a compound of the formula ##STR1## wherein R is an optionally substituted phenyl group, Y is selected from the group consisting of Me and a hydrocarbon, Me is a metal cation and E is selected from the group consisting of hydrogen and a metal cation comprising reacting a compound of the formula ##STR2## wherein Q is selected from the group consisting of hydrogen and a silyl protecting group, Rz is an optionally substituted phenyl with the proviso that any hydroxy group present on the phenyl are replaced by --OQz, wherein Qz is a silyl protecting group and Ez is a carboxyl protecting group, with a compound of the formula ##STR3## wherein Z is a halogen and X is selected from the group consisting of OY and Z at low temperatures under anhydrous conditions and carefully hydrolyzing the resulting product either with just enough water to remove protecting groups and hydrolyze the Z groups to hydroxy groups and, still under anhydrous conditions, reacting the c