Patents by Inventor J.M. Hasitha B. Jayasundara

J.M. Hasitha B. Jayasundara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Garment with conductive thread exposed on both sides
    Patent number: 10925540
    Abstract: A garment can be manufactured by bonding an adhesive to a first layer of fabric and a second layer of fabric. Holes are cut into each layer of fabric to accommodate the integration of sensors and a processing unit mount. Conductive thread embroidered onto a support layer is bonded to the adhesive of the second layer of fabric. The support layer is removed such that the conductive thread remains bonded to the adhesive. The layers of fabric are bonded together such that the conductive thread is coupled between the two layers of adhesive. A back plate is added to the layers of fabric to provide structural support for the mount. The conductive thread is exposed within each hole, and the mount and sensors can be coupled within the holes such that an electrical connection is established between the mount and at least one sensor via the conductive thread.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: February 23, 2021
    Assignee: Mad Apparel, Inc.
    Inventors: James Artel Berg, Hamid Hameed Butt, Liang Yao, Gaston J. MacMillan, J. M. Hasitha B. Jayasundara
  • GARMENT WITH CONDUCTIVE THREAD EXPOSED ON BOTH SIDES
    Publication number: 20180049698
    Abstract: A garment can be manufactured by bonding an adhesive to a first layer of fabric and a second layer of fabric. Holes are cut into each layer of fabric to accommodate the integration of sensors and a processing unit mount. Conductive thread embroidered onto a support layer is bonded to the adhesive of the second layer of fabric. The support layer is removed such that the conductive thread remains bonded to the adhesive. The layers of fabric are bonded together such that the conductive thread is coupled between the two layers of adhesive. A back plate is added to the layers of fabric to provide structural support for the mount. The conductive thread is exposed within each hole, and the mount and sensors can be coupled within the holes such that an electrical connection is established between the mount and at least one sensor via the conductive thread.
    Type: Application
    Filed: August 18, 2016
    Publication date: February 22, 2018
    Inventors: James Artel Berg, Hamid Hameed Butt, Liang Yao, Gaston J. MacMillan, J.M. Hasitha B. Jayasundara