Abstract: A method and a device are provided for estimating at least one component placement position on a substrate at which a component is to be placed. The component placement position is estimated on the basis of the position of at least one mark on the substrate. The statistical measurement inaccuracies of the marks are determined. Subsequently, the positional accuracy of the component placement position on the substrate is estimated on the basis of the measurement inaccuracies of the marks. Subsequently, the estimated positional accuracy of the component placement position is compared with a desired positional accuracy. Subsequently, a determination is made regarding whether the component is to be placed on the substrate with the estimated positional accuracy of the component placement position.