Patents by Inventor J. Mark Mersereau

J. Mark Mersereau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacture of polybutadiene and polyisoprene based thermosetting compositions
    Patent number: 6586533
    Abstract: Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250° C. The thermosetting compositions may include fillers such as particulate ceramic fillers and may also include woven webs for improved dimensional stability and decreased brittleness. The formation process of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated on one or both opposed surfaces to metal conductive foil (e.g., copper).
    Type: Grant
    Filed: May 4, 1994
    Date of Patent: July 1, 2003
    Assignee: World Properties, Inc.
    Inventors: Vincent R. Landi, J. Mark Mersereau, Walter A. Robbins, Michael E. St. Lawrence
  • Process for forming hard shaped molded article of a cross-linked liquid polybutadiene or polyisoprene resin and a butadiene or isoprene containing solid polymer and resulting articles
    Patent number: 5223568
    Abstract: A forming process for producing a hard shaped molded article that includes subjecting a moldable thermosetting composition to a high temperature cure condition at a temperature greater than about 250.degree. C. and less than the decomposition temperature of the composition to form a crosslinked polymeric network. In particular, the invention features a forming process for producing a hard shaped molded article that includes the steps of(a) providing a moldable thermosetting composition that includes 1) a polybutadiene or polyisoprene resin which is a liquid at room temperature and which has a molecular weight less than 5,000 and a large number of pendent vinyl groups and 2) a solid butadiene- or isoprene-containing polymer (e.g, a thermoplastic elastomer);(b) forming the composition into a shape; and(c) curing the composition to produce the article including subjecting the composition to a high temperature cure condition at a temperature greater than about 250.degree. C.
    Type: Grant
    Filed: May 9, 1989
    Date of Patent: June 29, 1993
    Assignee: Rogers Corporation
    Inventors: Vincent R. Landi, J. Mark Mersereau, Walter A. Robbins
  • Adhesion of phenolics to copper
    Patent number: 4281044
    Abstract: The bonding of phenolic resins and phenolic molding materials to copper is significantly improved by the addition to the phenolic material of elemental sulfur in a weight percentage from 0.005% to 1%, the weight percentage of sulfur being preferably from 0.01% to 0.2%.
    Type: Grant
    Filed: June 29, 1979
    Date of Patent: July 28, 1981
    Assignee: Rogers Corporation
    Inventors: Linwood A. Walters, J. Mark Mersereau