Patents by Inventor J. Martin Tenenbaum

J. Martin Tenenbaum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead design to facilitate post-reflow solder joint quality inspection
    Patent number: 5062567
    Abstract: An improved lead for surface-mounted electronic components is described. The improved lead includes an opening through the portion of the lead to be placed in contact with the printed circuit board for soldering. The opening, having a diameter approximately equal to the thickness of the lead, enables the detection of correctly-soldered joints using automated inspection equipment. When the lead is correctly soldered, solder is drawn by capillary action into the opening where it forms a meniscus. By automatically detecting the curvature of the meniscus, the quality of the solder joint may be determined.
    Type: Grant
    Filed: May 1, 1990
    Date of Patent: November 5, 1991
    Assignee: Schlumberger Technologies, Inc.
    Inventors: H. Keith Nishihara, P. Anthony Crossley, Neil D. Hunt, J. Martin Tenenbaum