Patents by Inventor J. Meade Coulson

J. Meade Coulson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for electroplating wafers
    Patent number: 5273642
    Abstract: An apparatus and corresponding method for electroplating wafers includes supporting a plurality of wafers on a backing board in the electroplating tank such that one surface of each wafer is masked from the electrolytic reaction. A programmable controller is used to regulate the waveform, frequency and duration of current passing between each individual wafer and a corresponding anode electrode during the electroplating process. Voltage is monitored between the wafers and the anode electrodes to ensure a proper electrical connection is maintained with each individual wafer during the electroplating process.
    Type: Grant
    Filed: December 9, 1992
    Date of Patent: December 28, 1993
    Assignee: ITT Corporation
    Inventors: James W. Crites, J. Meade Coulson
  • Apparatus and method for electroplating wafers
    Patent number: 5228967
    Abstract: An apparatus and corresponding method for electroplating wafers includes supporting a plurality of wafers on a backing board in the electroplating tank such that one surface of each wafer is masked from the electrolytic reaction. A programmable controller is used to regulate the waveform, frequency and duration of current passing between each individual wafer and a corresponding anode electrode during the electroplating process. Voltage is monitored between the wafers and the anode electrodes to ensure a proper electrical connection is maintained with each individual wafer during the electroplating process.
    Type: Grant
    Filed: April 21, 1992
    Date of Patent: July 20, 1993
    Assignee: ITT Corporation
    Inventors: James W. Crites, J. Meade Coulson