Abstract: An integrated thermal apparatus for improved electronic device performance has an energy storage device coupled with a thermoelectric management device for managing thermal energy generated by the electronic device. The thermoelectric management device can include a semiconductor thermoelectric device and phase change material, which can be integrated into a foam aluminum structure. The energy storage device can be a nanometallic device. The electrical load electrical efficiency is improved by co-locating it with thermoelectric management device directly on a composite substrate foundation to provide enhanced waste heat conversion to electrical energy. The apparatus manages the thermal and power issues at the substrate level in close proximity to the electrical load and incorporates the needed thermal mass into the support structure by way of a phase change material.

Abstract: An apparatus for absorbing thermal energy has an electronic component, a support structure for the electronic component having a first set of surfaces defining an interior volume containing a plurality of secondary surfaces, and a thermal energy absorbing material integrated within the interior volume, in contact with at least a portion of the secondary surfaces to form a composite structure. The thermal energy absorbing material is in operative thermal communication with the electronic component such that at least a portion of the thermal energy generated by the electronic component flows, via the support structure, into the thermal energy absorbing material. A method for controlling a temperature of an electronic component mounts an electronic component on a support structure in thermal communication with a thermal energy absorbing material integrated into an interior volume of the support structure.

Abstract: An apparatus for absorbing thermal energy has an electronic component, a support structure for the electronic component having a first set of surfaces defining an interior volume containing a plurality of secondary surfaces, and a thermal energy absorbing material integrated within the interior volume, in contact with at least a portion of the secondary surfaces to form a composite structure. The thermal energy absorbing material is in operative thermal communication with the electronic component such that at least a portion of the thermal energy generated by the electronic component flows, via the support structure, into the thermal energy absorbing material. A method for controlling a temperature of an electronic component mounts an electronic component on a support structure in thermal communication with a thermal energy absorbing material integrated into an interior volume of the support structure.

Abstract: An integrated thermal apparatus for improved electronic device performance has an energy storage device coupled with a thermoelectric management device for managing thermal energy generated by the electronic device. The thermoelectric management device can include a semiconductor thermoelectric device and phase change material, which can be integrated into a foam aluminum structure. The energy storage device can be a nanometallic device. The electrical load electrical efficiency is improved by co-locating it with thermoelectric management device directly on a composite substrate foundation to provide enhanced waste heat conversion to electrical energy. The apparatus manages the thermal and power issues at the substrate level in close proximity to the electrical load and incorporates the needed thermal mass into the support structure by way of a phase change material.