Patents by Inventor J. Neal Cox

J. Neal Cox has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit with a recessed conductive layer
    Patent number: 6653229
    Abstract: An improved method for making an integrated circuit. That method includes forming a first dielectric layer on a substrate, etching a trench into that layer, then filling the trench with a conductive material. The conductive material is then electropolished to form a recessed conductive layer within the first dielectric layer.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: November 25, 2003
    Assignee: Intel Corporation
    Inventor: J. Neal Cox
  • Method for making integrated circuits
    Publication number: 20020096778
    Abstract: An improved method for making an integrated circuit. That method includes forming a first dielectric layer on a substrate, etching a trench into that layer, then filling the trench with a conductive material. The conductive material is then electropolished to form a recessed conductive layer within the first dielectric layer.
    Type: Application
    Filed: January 29, 2002
    Publication date: July 25, 2002
    Inventor: J. Neal Cox
  • Method for making integrated circuits
    Patent number: 6383917
    Abstract: An improved method for making an integrated circuit. That method includes forming a first dielectric layer on a substrate, etching a trench into that layer, then filling the trench with a conductive material. The conductive material is then electropolished to form a recessed conductive layer within the first dielectric layer.
    Type: Grant
    Filed: October 21, 1999
    Date of Patent: May 7, 2002
    Assignee: Intel Corporation
    Inventor: J. Neal Cox