Patents by Inventor J. Paul Wasielewski

J. Paul Wasielewski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging module for a semiconductor wafer
    Patent number: 4603374
    Abstract: A package for housing a semiconductor wafer includes a case having a plurality of thermal conductive pads disposed on an inner surface thereof for supporting the wafer. A printed circuit board is equipped with a plurality of contact pins and further includes a plurality of electrically conductive plastic pads which engage contact pads on the wafer when the printed circuit board is disposed on the wafer. The remainder of the cavity within the case is filled with a sealant such as epoxy. If desired, additional electronic components may be positioned on the printed circuit board.
    Type: Grant
    Filed: July 3, 1984
    Date of Patent: July 29, 1986
    Assignee: Motorola, Inc.
    Inventor: J. Paul Wasielewski