Abstract: The invention relates to an endoscopic instrument (1) having an elongate body with a distal end (4) designed to be introduced into the body of the patient so as to come into proximity with an internal organ, the distal end carrying a tool (7) for intervention on the internal organ. The endoscopic instrument has a fool (10) rigidly connected to the distal end and designed to bear on the internal organ, and also controllable means (13) for conferring movements on the tool, at least in directions transverse to a longitudinal axis (X) of the distal end of the endoscopic instrument, when the foot is bearing against the internal organ.

Abstract: An electronic device includes an integrated circuit chip with an insulating passivation layer. An opening in the passivation layer uncovers a first region of an electrical contact. An electrical connection pad is formed to fill the opening by covering the first region and extend in projection in such a way as to cover a second region situated on the passivation layer surrounding the opening. The periphery of at least one of the first and second regions has an elongate or oblong shape. Centers of the opening and the pad are aligned with each other.

Abstract: The invention relates to an endoscopic instrument (1) having an elongate body with a distal end (4) designed to be introduced into the body of the patient so as to come into proximity with an internal organ, the distal end carrying a tool (7) for intervention on the internal organ. The endoscopic instrument has a fool (10) rigidly connected to the distal end and designed to bear on the internal organ, and also controllable means (13) for conferring movements on the tool, at least in directions transverse to a longitudinal axis (X) of the distal end of the endoscopic instrument, when the foot is bearing against the internal organ.

Abstract: A semiconductor package includes a support plate made of an electrically non-conducting material. Electrical connection vias are formed outside a chip fixing region provided on the front face of the support plate. Electrical connection wires connect pads on a front of the chip to pads on the front of the support plate associated with the electrical connection vias. The front face of the support plate is further provided with at least one intermediate front layer made of a thermally conducting material extending at least partly below the chip. The rear face of the support plate is provided with at least one rear layer made of a thermally conducting material extending at least partly opposite the front layer. The front and rear layers are connected by vias made of a thermally conducting material that fills through-holes made through the plate.