Abstract: The invention relates to a method for producing organosilanes of general formula I, [R(R)(R?O)Si—R?—]2Sm??I by reaction of (halo-organo)alkoxysilanes of formula II, [R(R)(R?O)Si—R?-Hal??II with a sulfuring reagent, selected from alkaline hydrogensulfide, alkaline sulfide Me2S, alkaline polysulfide Me2Sg and any combination thereof and optionally additionally with sulfur and/or with H2S in a solvent, the alkaline hydroxy content of all materials used being <0.44 wt. %.

Abstract: Methods for the production of printed circuit boards (1) with at least one electrically conductive through-plating which runs in a hole (5) in an insulating base material (2) from a first to a second surface include the following steps. The base material is pressed on its surfaces with two-layered foils (3, 4) consisting of a Cu foil (31, 32) covered with a Cu layer (32′, 42′), an acrylonitrile-butadiene-styrene-copolymer film (32″, 42″) or a self-adhesive plastic film (32*, 42*) in such a way that the Cu foils adhere well to the base material. The holes are produced and they as well as the exposed surfaces of the layers (32′, 42′; 32″, 42″; 32*, 42*) are provided with a further Cu layer (6, 6′). The metallized holes are completely filled with an insulating material (7) or with a conductive material (7′; 8) by spreading on with a squeegee or by rolling on to the exposed surface of the Cu layer (6, 6′).