Abstract: So as to perform a vacuum surface treatment on a workpiece at a predetermined temperature, which is different from a temperature to which the surface is exposed during the vacuum surface treatment, the workpiece is conveyed in a conveyance direction along one or more than one station group including one or more than one tempering station and of a single treatment station.

Abstract: Within a vacuum recipient plasma enhanced atomic layer deposition (PEALD) is performed in that precursor gas is inlet from a precursor gas inlet and a monomolecular layer is deposited on a substrate by adsorption. Subsequently a reactive gas is inlet through a reactive gas inlet and the monomolecular layer on the substrate is reacted, enhanced by UHF plasma which is generated to be distributed along a geometric locus which surrounds a substrate carrier and thus the substrate on this carrier.

Abstract: A method for manufacturing a surgical implant. A metal layer is deposited onto a polyaryletherketone (PAEK) substrate by generating a series of pulses using a high power impulse magnetron sputtering process. Each pulse is applied in a series of micro pulse steps comprising (i) micro pulse on steps ranging from 10 ?s to 100 ?s and (ii) micro pulse off steps ranging from 5 ?s as to 400 ?s; at a repetition frequency ranging from 50-2000 Hz with 2 micropulses to 20 micropulses per repetition, a total pulse on time ranging from 25 ?s to 800 ?s for 5 minutes to 300 minutes at averaged power ranging from 200 W to 3000 W. The series of pulses are performed in a unipolar mode or a bipolar mode.

Abstract: A coated product having coating that includes a layer of hard material having a defined multi-ply layer structure, thereby significantly minimizing or preventing heat input into the coated substrate resulting from the effect of thermal hot spots.

Abstract: A hard material layer system with a multilayer structure, comprising alternating layers A and B, with A layers having the composition MeApAOnANmA in atomic percent and B layers having the composition MeBpBOnBNmB in atomic percent, where the thermal conductivity of the A layers is greater than the thermal conductivity of the B layers. MeA and MeB each comprise at least one metal of the group Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, and Al, pA indicates the atomic percentage of MeA and pB indicates the atomic percentage of MeB and the following is true: PA=PB, nA indicates the oxygen concentration in the A layers in atomic percent and nB indicates the oxygen concentration in the B layers in atomic percent and the following is true: nA<nB, and mA indicates the nitrogen concentration in the A layers in atomic percent and mB indicates the nitrogen concentration in the B layers in atomic percent and the following is true: pA/(nA+mA)=pB/(nB+mB).

Abstract: A coated product having coating that includes a layer of hard material having a defined multi-ply layer structure, thereby significantly minimizing or preventing heat input into the coated substrate resulting from the effect of thermal hot spots.

Abstract: A hard material layer system with a multilayer structure, comprising alternating layers A and B, with A layers having the composition MeApAOANmA in atomic percent and B layers having the composition MeBpBOnBNmB in atomic percent, where the thermal conductivity of the A layers is greater than the thermal conductivity of the B layers. MeA and MeB each comprise at least one metal of the group Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, and Al, pA indicates the atomic percentage of MeA and pB indicates the atomic percentage of MeB and the following is true: PA=PB, nA indicates the oxygen concentration in the A layers in atomic percent and nB indicates the oxygen concentration in the B layers in atomic percent and the following is true: nA<nB, and mA indicates the nitrogen concentration in the A layers in atomic percent and mB indicates the nitrogen concentration in the B layers in atomic percent and the following is true: pA/(nA+mA)=pB/(nB+mB).

Abstract: A method for manufacturing a surgical implant. A metal layer is deposited onto a polyaryletherketone (PAEK) substrate by generating a series of pulses using a high power impulse magnetron sputtering process. Each pulse is applied in a series of micro pulse steps comprising (i) micro pulse on steps ranging from 10 ?s to 100 ?s and (ii) micro pulse off steps ranging from 5 ?s as to 400 ?s; at a repetition frequency ranging from 50-2000 Hz with 2 micropulses to 20 micropulses per repetition, a total pulse on time ranging from 25 ?s to 800 ?s for 5 minutes to 300 minutes at averaged power ranging from 200 W to 3000 W. The series of pulses are performed in a unipolar mode or a bipolar mode.