Abstract: An apparatus and method for a cutting blade having a pointed tip and ultra-flat faces that intersect at ultra-sharp edges. The cutting blade is batch-fabricated on a standard {100} semiconductor mono-crystalline silicon wafer using conventional anisotropic wet etching silicon micromachining techniques as a pair of spaced-apart substantially parallel and planar top and bottom surfaces each formed in {100} planes of a {100} mono-crystalline silicon substrate with first and second mutually rotated cutting edges formed between the top and bottom surfaces of the substrate and substantially parallel thereto in adjacent {111} planes that form a first pointed tip at an intersection therebetween, and having third and fourth cutting edges formed between the top and bottom surfaces of the substrate and substantially parallel thereto in adjacent {110} planes with the third and fourth cutting edges forming different pointed intersections with the first and second mutually rotated cutting edges.