Abstract: The invention relates to a laser chip located between a first and a second electrically and thermally conductive component, wherein: a first lateral surface of the laser chip is connected in a planar manner to a first lateral surface of the first component; the second lateral surface of the laser chip is connected in a planar manner to a first lateral surface of the second component; the laser chip has a radiation side which is located between the components; the radiation side is arranged set back inwardly at a predefined distance from the first end faces of the components; and a radiation space, which extends from the radiation side of the laser chip to the first end faces of the components is formed between the first lateral surfaces of the two components and adjacent to the radiation side of the laser chip.

Abstract: A laser device comprises a hermetic housing that has an interior and is made at least in part of printed circuit board material, a laser element located in the interior, and at least one inorganic layer which hermetically shields the interior from the printed circuit board material.

Abstract: The invention relates to an LED package for UV light comprising an optoelectronic device which, in particular as a volume emitter, is designed to emit light in the ultraviolet spectrum during operation. The component is arranged on a carrier with two contact pads for electrical contacting. Furthermore, a frame surrounding the component and arranged on the carrier is provided with a gas-impermeable outlet region lying in a main radiation direction, so that a hermetically sealed cavity comprising an inner region of the carrier is formed, the side walls of the frame facing the optoelectronic device being bevelled and opening towards the main radiation direction. An ESD protection element arranged outside the inner area on the carrier is electrically connected to at least one of the two contact pads.

Abstract: The invention relates to a method for producing optoelectronic components. The invention comprises: provision of a metal substrate, the substrate having a front side and a rear side opposite the front side; front-side removal of substrate material such that the substrate comprises substrate sections protruding in the region of the front side and recesses arranged there between; formation of a plastic body adjacent to substrate sections; arrangement of optoelectronic semiconductor chips on substrate sections; rear-side removal of substrate material in the region of the recesses, such that the substrate is structured into separate substrate sections; and performance of a separation process. The plastic body is divided into separate substrate sections and individual optoelectronic components with at least one optoelectronic semiconductor chip are formed. The invention also relates to an optoelectronic component.

Abstract: The invention relates to an LED package for UV light comprising an optoelectronic device which, in particular as a volume emitter, is designed to emit light in the ultraviolet spectrum during operation. The component is arranged on a carrier with two contact pads for electrical contacting. Furthermore, a frame surrounding the component and arranged on the carrier is provided with a gas-impermeable outlet region lying in a main radiation direction, so that a hermetically sealed cavity comprising an inner region of the carrier is formed, the side walls of the frame facing the optoelectronic device being beveled and opening towards the main radiation direction. An ESD protection element arranged outside the inner area on the carrier is electrically connected to at least one of the two contact pads.

Abstract: An irradiation unit is disclosed that includes a pump radiation source for emitting pump radiation in the form of a beam, a conversion element for at least partially converting the pump radiation into conversion radiation, and a support on which the conversion element is situated. The support accommodates a through-hole through which the beam including the pump radiation is incident on an incident surface of the conversion element, the though-hole being laterally delimited by an inner wall face of the support, at least one portion of the face tapering in the direction of the incident surface. During operation, the pump radiation conducted in the beam is at least intermittently at least in part, incident on the inner wall face of the support and is reflected thereby onto the incident surface.

Abstract: A laser device comprises a hermetic housing that has an interior and is made at least in part of printed circuit board material, a laser element located in the interior, and at least one inorganic layer which hermetically shields the interior from the printed circuit board material.

Abstract: The invention relates to a laser chip located between a first and a second electrically and thermally conductive component, wherein: a first lateral surface of the laser chip is connected in a planar manner to a first lateral surface of the first component; the second lateral surface of the laser chip is connected in a planar manner to a first lateral surface of the second component; the laser chip has a radiation side which is located between the components; the radiation side is arranged set back inwardly at a predefined distance from the first end faces of the components; and a radiation space, which extends from the radiation side of the laser chip to the first end faces of the components is formed between the first lateral surfaces of the two components and adjacent to the radiation side of the laser chip.

Abstract: An irradiation unit is disclosed that includes a pump radiation source for emitting pump radiation in the form of a beam, a conversion element for at least partially converting the pump radiation into conversion radiation, and a support on which the conversion element is situated. The support accommodates a through-hole through which the beam including the pump radiation is incident on an incident surface of the conversion element, the though-hole being laterally delimited by an inner wall face of the support, at least one portion of the face tapering in the direction of the incident surface. During operation, the pump radiation conducted in the beam is at least intermittently at least in part, incident on the inner wall face of the support and is reflected thereby onto the incident surface.

Abstract: The invention relates to a method for producing optoelectronic components. The invention comprises: provision of a metal substrate, the substrate having a front side and a rear side opposite the front side; front-side removal of substrate material such that the substrate comprises substrate sections protruding in the region of the front side and recesses arranged there between; formation of a plastic body adjacent to substrate sections; arrangement of optoelectronic semiconductor chips on substrate sections; rear-side removal of substrate material in the region of the recesses, such that the substrate is structured into separate substrate sections; and performance of a separation process. The plastic body is divided into separate substrate sections and individual optoelectronic components with at least one optoelectronic semiconductor chip are formed. The invention also relates to an optoelectronic component.

Abstract: An irradiation unit includes a pump radiation source for the emission of pump radiation; and a conversion element for the at least partial conversion of the pump radiation to a conversion radiation. During operation of the irradiation unit, the pump radiation is incident in the form of a beam from the pump radiation source on an incidence surface of the conversion element. A first portion of the pump radiation is incident on the conversion element in a central segment of the beam and a second portion of the pump radiation is incident on the conversion element in an edge segment of the beam surrounding the central segment. The conversion element is provided in such a way that a normalized degree of conversion and/or a normalized degree of scattering is lower for the second portion of the pump radiation than for the first portion of the pump radiation.

Abstract: A reflective laser activated remote phosphor (LARP) package comprising: a phosphor platelet oriented in a first plane defined by an x-y plane; a laser diode (LD) positioned to be offset along the x-axis from the phosphor platelet and above the first plane along a z-axis perpendicular to the x-y plane, the LD comprising: an output facet configured for emitting a laser beam (LB), the LB comprising: a slow axis oriented in a first direction along which the LB diverges at a first angle; and a fast axis oriented in a second direction along which the LB diverges at a second angle greater than the first angle; wherein the LD is oriented such that: the LB is bisected by the phosphor platelet such that the slow axis of the LB lies in an x-z plane and the fast axis of the LB is perpendicular to an x-z plane.

Abstract: A light generating device, comprising: at least one light emitting diode having a semiconductor layer that emits a first primary light, and having a phosphor layer arranged on the semiconductor layer, and at least one laser for generating at least one laser beam composed of a second primary light, by means of which the phosphor layer is irradiatable, wherein the phosphor layer is configured for at least partly converting the first primary light into at least one first secondary light and for at least partly converting the second primary light into at least one second secondary light. The light generating device is configured to dynamically illuminate the phosphor layer by means of the second primary light.

Abstract: An irradiation unit includes a pump radiation source for the emission of pump radiation; and a conversion element for the at least partial conversion of the pump radiation to a conversion radiation. During operation of the irradiation unit, the pump radiation is incident in the form of a beam from the pump radiation source on an incidence surface of the conversion element. A first portion of the pump radiation is incident on the conversion element in a central segment of the beam and a second portion of the pump radiation is incident on the conversion element in an edge segment of the beam surrounding the central segment. The conversion element is provided in such a way that a normalized degree of conversion and/or a normalized degree of scattering is lower for the second portion of the pump radiation than for the first portion of the pump radiation.

Abstract: A laser-activated remote phosphor (LARP) target with a first layer having a first index of refraction and a phosphor dispersed within the first layer. A second layer which has a second index of refraction different from the first index of refraction and adjoins the first layer at an interface. The first index of refraction is higher than the second index of refraction such that the interface is configured to at least partially reflect light emitted from the phosphor.

Abstract: Techniques for bonding a luminescent material to a thermally conductive substrate using a low temperature glass to provide a wavelength converter system are provided. A dichroic coating is deposited on a thermally conductive substrate. The dichroic coating includes alternating layers of a first material having a first refractive index and a second material having a second refractive index which is greater than the first refractive index. A buffer layer is deposited on the dichroic coating. A wavelength converter is bonded to the buffer layer by a layer of low temperature glass. In some embodiments, the wavelength converter includes a phosphor for converting a primary light from an excitation source into a secondary light.

Abstract: A laser activated remote phosphor system may include a radiation source configured to emit excitation radiation and a conversion element which has a phosphor and is able to be irradiated by the excitation radiation. An input coupling surface of the conversion element has a delimitation line beyond which a central excitation spot of the excitation radiation radiates at least in sections.

Abstract: A reflective laser activated remote phosphor (LARP) package comprising: a phosphor platelet oriented in a first plane defined by an x-y plane; a laser diode (LD) positioned to be offset along the x-axis from the phosphor platelet and above the first plane along a z-axis perpendicular to the x-y plane, the LD comprising: an output facet configured for emitting a laser beam (LB), the LB comprising: a slow axis oriented in a first direction along which the LB diverges at a first angle; and a fast axis oriented in a second direction along which the LB diverges at a second angle greater than the first angle; wherein the LD is oriented such that: the LB is bisected by the phosphor platelet such that the slow axis of the LB lies in an x-z plane and the fast axis of the LB is perpendicular to an x-z plane.

Abstract: A light generating device, comprising: at least one light emitting diode having a semiconductor layer that emits a first primary light, and having a phosphor layer arranged on the semiconductor layer, and at least one laser for generating at least one laser beam composed of a second primary light, by means of which the phosphor layer is irradiatable, wherein the phosphor layer is configured for at least partly converting the first primary light into at least one first secondary light and for at least partly converting the second primary light into at least one second secondary light. The light generating device is configured to dynamically illuminate the phosphor layer by means of the second primary light.

Abstract: A laser-activated remote phosphor (LARP) target with a first layer having a first index of refraction and a phosphor dispersed within the first layer. A second layer which has a second index of refraction different from the first index of refraction and adjoins the first layer at an interface. The first index of refraction is higher than the second index of refraction such that the interface is configured to at least partially reflect light emitted from the phosphor.