Patents by Inventor Jörg Werner Rischke

Jörg Werner Rischke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for bonding solder balls to a substrate
    Patent number: 6234382
    Abstract: The invention relates to a method and a device for bonding solder balls to connecting points which are provided on a substrate in a predetermined pattern. The solder balls are placed into holes provided in a plate-shaped element, which holes are each capable of accommodating one solder ball, and which are provided in the plate-shaped element in a pattern which corresponds with the pattern of the connecting points on the substrate. A combination of at least one substrate and a plate-shaped element containing solder balls is passed, by means of a conveying element, through a housing in which the solder balls are subjected to a heat treatment. The combinations, which each consist of at least one plate-shaped element and at least one substrate, are passed through the housing by the conveying element via lock mechanisms disposed near an inlet and near an outlet of the housing. Inside the housing the solder balls are placed into the holes provided in the plate-shaped element.
    Type: Grant
    Filed: April 16, 1998
    Date of Patent: May 22, 2001
    Assignee: Meco Equipment Engineers B.V.
    Inventors: Jörg Werner Rischke, Hugo Franklin Menschaar, Robert Kloosterboer