Patents by Inventor Jörg Zapf
Jörg Zapf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230238894Abstract: Various embodiments of the teachings herein include a rectifier. The rectifier may include: a rectifier circuit formed with current valves with microelectromechanical systems (MEMS) switches; and a switching controller driving the MEMS switches to switch and open. The switching controller opens the MEMS switches when a voltage feeding the rectifier falls below a minimum distance from a zero voltage.Type: ApplicationFiled: May 14, 2021Publication date: July 27, 2023Applicant: Siemens AktiengesellschaftInventors: Franziska Lambrecht, Markus Schwarz, Harald Schweigert, Jörg Zapf
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Publication number: 20230074572Abstract: Various embodiments of the teachings herein include an electronic module comprising: a circuit carrier with an electrically conductive thick film with a thickness of at least 0.5 millimeter; and a plurality of thermally conductive elements connected to one another by a thermally conductive material. The thermally conductive elements have a base area with rotational symmetry.Type: ApplicationFiled: January 28, 2021Publication date: March 9, 2023Applicant: Siemens AktiengesellschaftInventors: Hubert Baueregger, Albrecht Donat, Axel Ganster, Franziska Lambrecht, Markus Lasch, Stefan Stegmeier, Erik Weisbrod, Jörg Zapf
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Patent number: 11181408Abstract: A thermoresistive gas sensor, e.g. for a flow sensor or a thermal conductivity detector, has a lattice with lattice webs, which consist of a semiconductor material arranged in the plane of the lattice in parallel next to one another, wherein the semiconductor material is formed on a plate-shaped semiconductor substrate that extends over a window-like cutout in the semiconductor substrate and forms the lattice, where the semiconductor layer is doped outside the cutout in areas of two ends of the lattice at least over the width of the lattice until it degenerates and/or bears metallizations, where the semiconductor layer further contains a separation structure insulating the two ends of the lattice from one another, in which the semiconductor material is removed or is not doped, and where the lattice webs extend in an S shape and are connected electrically in parallel to achieve a high measurement sensitivity and mechanical stability.Type: GrantFiled: March 28, 2019Date of Patent: November 23, 2021Assignee: Siemens AktiengesellschaftInventors: Sebastian Kisban, Stefan Klehr, Thomas Neuhauser, Piotr Strauch, Jörg Zapf, Jürgen Zettner, Stefan Von Dosky
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Patent number: 10714228Abstract: A method for producing a microstructure component, a microstructure component and an x-ray device are disclosed. In the method, a plurality of punctiform injection structures are inserted in a grid in a first substrate direction and a second substrate direction, standing at right angles thereto, into a first surface of a wafer-like silicon substrate. The injection structures are lengthened into drilled holes in the depth direction of the silicon substrate in a first etching step. A second surface of the silicon substrate is then at least partly removed for rear-side opening of the drilled holes in a second etching step and in a third etching step, an etching medium acting anisotropically is poured alternately through the drilled holes from both surfaces of the silicon substrate, so that drilled holes arranged next to one another in the first substrate direction connect to form a column running in the first substrate direction.Type: GrantFiled: February 21, 2019Date of Patent: July 14, 2020Assignee: SIEMENS HEALTHCARE GMBHInventors: Andrea Deutinger, Joerg Zapf
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Publication number: 20190301908Abstract: A thermoresistive gas sensor, e.g. for a flow sensor or a thermal conductivity detector, has a lattice with lattice webs, which consist of a semiconductor material arranged in the plane of the lattice in parallel next to one another, wherein the semiconductor material is formed on a plate-shaped semiconductor substrate that extends over a window-like cutout in the semiconductor substrate and forms the lattice, where the semiconductor layer is doped outside the cutout in areas of two ends of the lattice at least over the width of the lattice until it degenerates and/or bears metallizations, where the semiconductor layer further contains a separation structure insulating the two ends of the lattice from one another, in which the semiconductor material is removed or is not doped, and where the lattice webs extend in an S shape and are connected electrically in parallel to achieve a high measurement sensitivity and mechanical stability.Type: ApplicationFiled: March 28, 2019Publication date: October 3, 2019Inventors: Sebastian Kisban, Stefan KLEHR, Thomas NEUHAUSER, Piotr STRAUCH, Jörg ZAPF, Jürgen ZETTNER, Stefan VON DOSKY
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Publication number: 20190267149Abstract: A method for producing a microstructure component, a microstructure component and an x-ray device are disclosed. In the method, a plurality of punctiform injection structures are inserted in a grid in a first substrate direction and a second substrate direction, standing at right angles thereto, into a first surface of a wafer-like silicon substrate. The injection structures are lengthened into drilled holes in the depth direction of the silicon substrate in a first etching step. A second surface of the silicon substrate is then at least partly removed for rear-side opening of the drilled holes in a second etching step and in a third etching step, an etching medium acting anisotropically is poured alternately through the drilled holes from both surfaces of the silicon substrate, so that drilled holes arranged next to one another in the first substrate direction connect to form a column running in the first substrate direction.Type: ApplicationFiled: February 21, 2019Publication date: August 29, 2019Applicant: Siemens Healthcare GmbHInventors: Andrea DEUTINGER, Joerg ZAPF
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Patent number: 9999120Abstract: The invention relates to a circuit carrier (11), comprising a digital circuit, which contains at least two components (12, 14) that are electrically connected to each other (19, 21, 20). Additionally, an electric shield (24) is provided. According to the invention, the electric shield (24) and a conducting path (21) for electrically connecting the components (12, 14) are realized by means of a single layered composite (18). In particular, the electric shield (24) and the conducting path (21) are formed by the same electrically conductive layer, wherein a hole (25) ensures complete electrical insulation of the conducting path (21) from the shield (24). The invention further relates to a method for producing such a circuit carrier.Type: GrantFiled: November 27, 2012Date of Patent: June 12, 2018Assignee: Siemens AktiengesellschaftInventors: Florian Poprawa, Markus Schieber, Christina Schindler, Jörg Zapf
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Thermoelement including a three-dimensional microstructure, and method for producing a thermoelement
Patent number: 9884759Abstract: A three-dimensional micro-structure has a plurality of adjacent micro-columns which are arranged at a distance from each other and essentially parallel in relation to the respective longitudinal extension. The micro-columns are made of at least one micro-column material having respectively an aspect ratio in the region of 20-1000 and respectively a micro-column diameter in the region of 0.1 ?m-200 ?m. A micro-column intermediate chamber is arranged between adjacent micro-columns having a micro-column distance selected from between the adjacent micro-columns in the region of 1 ?m-100 ?m. According to a method for producing the three-dimensional micro-structures: a) a template is provided with template material, b) the micro-column material is arranged in the column-like cavities, and c) the template is at least partially removed.Type: GrantFiled: September 20, 2010Date of Patent: February 6, 2018Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Harry Hedler, Jörg Zapf -
Patent number: 9887339Abstract: An infrared sensor with a microstructure has a multiplicity of sensor rods protruding from a sensor base and arranged axially parallel to one another. Each of the sensor rods is designed as a thermocouple, in that a first rod end, arranged on the sensor base, is electrically connected to an opposite free second rod end by both a first and a second electrically conductive rod element. The two rod elements have a different Seebeck coefficient, and the first rod element is formed as a hollow profile and the second rod element is arranged in the first rod element such that each thermocouple is formed as a single rod with a small standing area on the sensor base.Type: GrantFiled: February 11, 2013Date of Patent: February 6, 2018Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Harry Hedler, Ingo Kuehne, Markus Schieber, Joerg Zapf
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Publication number: 20170189882Abstract: The disclosure pertains to a microstructure for adsorbing/desorbing at least one gas component of a gas supplied to the microstructure. The microstructure includes a semiconductor substrate having a bottom and a top. The microstructure also includes a plurality of micro-channels, extending from the bottom to the top of the semiconductor substrate. A top surface of micro-channel is configured to adsorb and/or desorb the at least one gas component when the gas is passed through the micro-channels.Type: ApplicationFiled: June 15, 2015Publication date: July 6, 2017Inventors: Ignaz EISELE, Maximilian FLEISCHER, Harry HEDLER, Markus SCHIEBER, Jörg ZAPF
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Patent number: 9506831Abstract: A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening.Type: GrantFiled: March 8, 2013Date of Patent: November 29, 2016Assignee: EPCOS AGInventors: Michael Schiffer, Andreas Peschka, Jörg Zapf, Karl Weidner, Harry Hedler
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Patent number: 9170226Abstract: At least two separate single-crystal silicon layers are formed in a micromechanical substrate which has a diaphragm in a partial region. The diaphragm has a thickness of less than 20 ?m and includes part of a first of the single-crystal silicon layers. The substrate construction also includes a heating element configured to generate a temperature of more than 650° C. in at least part of the diaphragm. The substrate includes at least one diffusion barrier layer that reduces the oxidation of the first single-crystal silicon layer.Type: GrantFiled: May 23, 2011Date of Patent: October 27, 2015Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Maximilian Fleischer, Oliver Freudenberg, Harry Hedler, Markus Schieber, Manfred Schreiner, Karl Weidner, Kerstin Wiesner, Jörg Zapf
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Patent number: 9134390Abstract: The present embodiments relate to a magnetic resonance local coil with a receive antenna for receiving magnetic resonance signals. The magnetic resonance local coil also includes a transmission unit for transmitting magnetic resonance signal data generated on the basis of the magnetic resonance signals via a data transmit antenna of the magnetic resonance local coil to a signal data receiving unit of a magnetic resonance tomography systems. The transmission unit is provided, at least in sections, with screening with a first metal coating and a first dielectric coating.Type: GrantFiled: March 30, 2012Date of Patent: September 15, 2015Assignee: Siemens AktiengesellschaftInventors: Daniel Evers, Klaus Huber, Florian Poprawa, Christina Schindler, Markus Vester, Jörg Zapf
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Publication number: 20150048249Abstract: An infrared sensor with a microstructure has a multiplicity of sensor rods protruding from a sensor base and arranged axially parallel to one another. Each of the sensor rods is designed as a thermocouple, in that a first rod end, arranged on the sensor base, is electrically connected to an opposite free second rod end by both a first and a second electrically conductive rod element. The two rod elements have a different Seebeck coefficient, and the first rod element is formed as a hollow profile and the second rod element is arranged in the first rod element such that each thermocouple is formed as a single rod with a small standing area on the sensor base.Type: ApplicationFiled: February 11, 2013Publication date: February 19, 2015Applicant: SIEMENS AKTIENGESELLSCHAFTInventors: Harry Hedler, Ingo Kuehne, Markus Schieber, Joerg Zapf
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Publication number: 20150027224Abstract: A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening.Type: ApplicationFiled: March 8, 2013Publication date: January 29, 2015Applicant: EPCOS AGInventors: Michael Schiffer, Andreas Peschka, Jörg Zapf, Karl Weidner, Harry Hedler
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Publication number: 20150016073Abstract: The invention relates to a circuit carrier (11), comprising a digital circuit, which contains at least two components (12, 14) that are electrically connected to each other (19, 21, 20). Additionally, an electric shield (24) is provided. According to the invention, the electric shield (24) and a conducting path (21) for electrically connecting the components (12, 14) are realized by means of a single layered composite (18). In particular, the electric shield (24) and the conducting path (21) are formed by the same electrically conductive layer, wherein a hole (25) ensures complete electrical insulation of the conducting path (21) from the shield (24). The invention further relates to a method for producing such a circuit carrier.Type: ApplicationFiled: November 27, 2012Publication date: January 15, 2015Inventors: Florian Poprawa, Markus Schieber, Christina Schindler, Jörg Zapf
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Publication number: 20140084428Abstract: A substrate of an integrated circuit has a first surface and an opposing second surface. A functionalized region is formed at least on the first surface. At least one electrical through-plating is provided as a through-hole which is continuously filled with an electrically conductive material and which runs from the first surface to the second surface through the substrate. To ensure that the through-plating can be reliably produced and is provided in a space-saving manner, the through-hole has at least one gradation on which a transition occurs from a smaller hole cross-section on the side of the first surface to a larger hole cross-section on the side of the second surface.Type: ApplicationFiled: March 7, 2012Publication date: March 27, 2014Applicant: SIEMENS AKTIENGESELLSCHAFTInventors: Harry Hedler, Markus Schieber, Stefan Wirth, Jörg Zapf
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Publication number: 20130264660Abstract: At least two separate single-crystal silicon layers are formed in a micromechanical substrate which has a diaphragm in a partial region. The diaphragm has a thickness of less than 20 ?m and includes part of a first of the single-crystal silicon layers. The substrate construction also includes a heating element configured to generate a temperature of more than 650° C. in at least part of the diaphragm. The substrate includes at least one diffusion barrier layer that reduces the oxidation of the first single-crystal silicon layer.Type: ApplicationFiled: May 23, 2011Publication date: October 10, 2013Applicant: SIEMENS AKTIENGESELLSCHAFTInventors: Maximilian Fleischer, Oliver Freudenberg, Harry Hedler, Markus Schieber, Manfred Schreiner, Karl Weidner, Kerstin Wiesner, Jörg Zapf
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Patent number: 8487257Abstract: In a device for the detection of thermal radiation and a method for production of such a device, a stack is formed with a detector support having a detector element for converting the thermal radiation into an electric signal, a circuit support with a read-out circuit for reading out the electrical signal and a cover to shield the detector element. The detector support and the cover are so arranged that a first stack cavity is formed between the detector element and the cover and a second stack cavity is formed between detector support and the circuit support. The first stack cavity and/or the second stack cavity is evacuated and hermetically sealed. In the manufacturing operation, functionalized silicon-substrates are stacked upon one another, firmly bonded together and subsequently sub-divided. Preferably, the detector elements are pyro-electric detector elements. The device finds application in motion detectors, presence reporters and thermal-image cameras.Type: GrantFiled: May 28, 2008Date of Patent: July 16, 2013Assignee: Pyreos Ltd.Inventors: Carsten Giebeler, Matthias Schreiter, Jörg Zapf
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Publication number: 20120249148Abstract: The present embodiments relate to a magnetic resonance local coil with a receive antenna for receiving magnetic resonance signals. The magnetic resonance local coil also includes a transmission unit for transmitting magnetic resonance signal data generated on the basis of the magnetic resonance signals via a data transmit antenna of the magnetic resonance local coil to a signal data receiving unit of a magnetic resonance tomography systems. The transmission unit is provided, at least in sections, with screening with a first metal coating and a first dielectric coating.Type: ApplicationFiled: March 30, 2012Publication date: October 4, 2012Inventors: Daniel Evers, Klaus Huber, Florian Poprawa, Christina Schindler, Markus Vester, Jörg Zapf