Patents by Inventor JÜRGEN BÖHMER

JÜRGEN BÖHMER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210297001
    Abstract: A modular power converter with wide-bandgap semiconductors, in particular SiC semiconductors. The modular power converter has at least two base units. The base units are connected together on the input side, and each base unit has an input circuit on the input side and an output circuit on the output side. The input circuit and the output circuit are each formed by the wide-bandgap semiconductors arranged in a B6-bridge circuit. An intermediate circuit capacitor is connected in parallel with the input circuit and the output circuit forming an intermediate circuit. The input circuits of the base units or a sub-quantity of the base units are arranged in a series circuit. At least one inductor is arranged between each pair of input circuits.
    Type: Application
    Filed: July 22, 2019
    Publication date: September 23, 2021
    Applicant: Siemens Aktiengesellschaft
    Inventors: MARK-MATTHIAS BAKRAN, JÜRGEN BÖHMER, MARTIN HELSPER, EBERHARD ULRICH KRAFFT, BERND LASKA, ANDREAS NAGEL, STEFAN HANS WERNER SCHÖNEWOLF, JAN WEIGEL
  • Publication number: 20210211123
    Abstract: With a method and an actuation arrangement for actuating a MOSFET, in particular a wide-bandgap semiconductor MOSFET, a monitoring process is performed to determine whether the body diode of the MOSFET is electrically conducting or blocking. If the body diode is electrically conducting, the MOSFET is activated, and if the body diode is electrically blocking, the MOSFET is actuated in response to an actuation signal generated based on the drain-source voltage and the direction and intensity of the drain-source current of the MOSFET.
    Type: Application
    Filed: May 15, 2019
    Publication date: July 8, 2021
    Applicant: Siemens Aktiengesellschaft
    Inventors: MARK-MATTHIAS BAKRAN, JÜRGEN BÖHMER, MARTIN HELSPER, EBERHARD ULRICH KRAFFT, BERND LASKA, ANDREAS NAGEL, STEFAN HANS WERNER SCHÖNEWOLF, JAN WEIGEL
  • Patent number: 10680602
    Abstract: A control device for driving a bipolar switchable power semiconductor component is designed to apply an electrical voltage to a gate terminal of the power semiconductor component and to reduce the electrical voltage for turning off the power semiconductor component from a first voltage value to a second voltage value. The control device is designed, for turning off the power semiconductor component, firstly to reduce the electrical voltage from the first voltage value to a desaturation value and then to reduce the electrical voltage from the desaturation value to the second voltage value. The desaturation value is greater than a pinch-off voltage of the power semiconductor component.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: June 9, 2020
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Jürgen Böhmer, Rüdiger Kleffel, Eberhard Ulrich Krafft, Andreas Nagel, Jan Weigel
  • Publication number: 20190379373
    Abstract: A control device for driving a bipolar switchable power semiconductor component is designed to apply an electrical voltage to a gate terminal of the power semiconductor component and to reduce the electrical voltage for turning off the power semiconductor component from a first voltage value to a second voltage value. The control device is designed, for turning off the power semiconductor component, firstly to reduce the electrical voltage from the first voltage value to a desaturation value and then to reduce the electrical voltage from the desaturation value to the second voltage value. The desaturation value is greater than a pinch-off voltage of the power semiconductor component.
    Type: Application
    Filed: November 7, 2017
    Publication date: December 12, 2019
    Applicant: Siemens Aktiengesellschaft
    Inventors: Jürgen BÖHMER, Rüdiger KLEFFEL, Eberhard Ulrich KRAFFT, Andreas NAGEL, Jan WEIGEL
  • Patent number: 10374521
    Abstract: A busbar arrangement for making electrical contact with a semiconductor module includes at least two busbars overlapping in an overlap region and electrically insulated from one another. Each busbar includes a web having a connection element, with the webs of the busbars being arranged without an overlap. The webs are oriented such as to define a first axis which runs through the connection element of an associated one of the webs and a point of a transition of the web to the overlap region of the busbar arrangement, and which intersects a second axis which is formed by a connection between two connection elements of the webs at an angle between 0° and 45°. The busbar arrangement includes an insulating region to reduce or prevent a current in the web in a direction perpendicular to the second axis. The overlap region and the webs are each located in one plane.
    Type: Grant
    Filed: November 25, 2016
    Date of Patent: August 6, 2019
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Jürgen Böhmer, Rüdiger Kleffel, Eberhard Ulrich Krafft, Andreas Nagel, Jan Weigel
  • Publication number: 20190149059
    Abstract: A phase module for a power converter includes first and second busbars and at least two semiconductor modules. The first busbar is connected to AC voltage connections of the semiconductor modules. The second busbar is connected to DC voltage connections of the semiconductor modules. At least one section of the first and second busbars is arranged at a distance to one another, the value of which is less than half the value of the distance between the AC voltage connection and the DC voltage connection of one of the semiconductor modules. At least one of the busbars has a separator arranged at a right angle on the remaining part of the busbar and connecting the busbar to at least one of the DC voltage connections or one of the AC voltage connections of one of the semiconductor modules. The separator is arranged along a surface of the one semiconductor module.
    Type: Application
    Filed: March 24, 2017
    Publication date: May 16, 2019
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: JÜRGEN BÖHMER, RÜDIGER KLEFFEL, EBERHARD ULRICH KRAFFT, JAN WEIGEL, STEFAN BOIGK
  • Publication number: 20190036461
    Abstract: A busbar arrangement for making electrical contact with a semiconductor module includes at least two busbars overlapping in an overlap region and electrically insulated from one another. Each busbar includes a web having a connection element, with the webs of the busbars being arranged without an overlap. The webs are oriented such as to define a first axis which runs through the connection element of an associated one of the webs and a point of a transition of the web to the overlap region of the busbar arrangement, and which intersects a second axis which is formed by a connection between two connection elements of the webs at an angle between 0° and 45°. The busbar arrangement includes an insulating region to reduce or prevent a current in the web in a direction perpendicular to the second axis. The overlap region and the webs are each located in one plane.
    Type: Application
    Filed: November 25, 2016
    Publication date: January 31, 2019
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: JÜRGEN BÖHMER, RÜDIGER KLEFFEL, EBERHARD ULRICH KRAFFT, ANDREAS NAGEL, JAN WEIGEL